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MAX393CUE

MAX393CUE

Manufacturer No:

MAX393CUE

Description:

IC SW SPST-NO/NCX4 35OHM 16TSSOP

Datasheet:

Datasheet

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MAX393CUE Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    9pF, 9pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    130ns, 75ns
  • Voltage - Supply, Dual (V±)
    ±3V ~ 8V
  • Voltage - Supply, Single (V+)
    3V ~ 15V
  • Channel-to-Channel Matching (ΔRon)
    300mOhm
  • On-State Resistance (Max)
    35Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The M2S050T-1FGG896 is an integrated circuit chip from Microsemi, which belongs to their SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S050T-1FGG896 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 processor core. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, processor, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family emphasizes security features, including secure boot, tamper detection, and data encryption. This makes the M2S050T-1FGG896 chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 processor provide high-performance computing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S050T-1FGG896 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and processor, the chip can be used in IoT devices for edge computing, data processing, and connectivity. Its security features also make it suitable for secure IoT applications. 3. Aerospace and defense: The chip's security features, low power consumption, and high performance make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, or military-grade embedded systems. 4. Medical devices: The chip's versatility and security features make it suitable for medical devices that require customization, real-time processing, and data protection. It can be used in devices such as patient monitors, imaging systems, or implantable devices. 5. Communications: The chip's FPGA fabric can be used for protocol conversion, signal processing, or encryption in communication systems. Its low power consumption also makes it suitable for portable communication devices.These are just a few examples, and the M2S050T-1FGG896 chip can be applied in various other domains where a combination of FPGA and processor capabilities is required.
MAX393CUE Relevant information