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MAX389EWG

MAX389EWG

Manufacturer No:

MAX389EWG

Description:

IC SWITCH SP4T X 2 3KOHM 24SOIC

Datasheet:

Datasheet

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MAX389EWG Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-SOIC
  • Package / Case
    24-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 25pF
  • Charge Injection
    55pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    1.5µs, 1µs
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 18V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    300Ohm
  • On-State Resistance (Max)
    3kOhm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The M2S060-FCSG325 is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S060-FCSG325 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S060-FCSG325, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require robust security measures. 4. Low power consumption: The M2S060-FCSG325 chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications.Application scenarios: 1. Industrial automation: The M2S060-FCSG325 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. Its FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller subsystem, the chip can be used in IoT devices for edge computing, data processing, and connectivity. Its security features also make it suitable for secure IoT applications. 3. Aerospace and defense: The M2S060-FCSG325 chip's robustness, security features, and low power consumption make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, and military-grade equipment. 4. Medical devices: The chip's versatility and integration make it suitable for medical devices such as patient monitoring systems, diagnostic equipment, and portable medical devices. Its low power consumption is beneficial for battery-powered medical devices. 5. Automotive: The M2S060-FCSG325 chip can be used in automotive applications such as advanced driver-assistance systems (ADAS), infotainment systems, and vehicle control units. Its FPGA fabric allows for customization and adaptation to specific automotive requirements.These are just a few examples of the advantages and application scenarios of the M2S060-FCSG325 chip. The versatility and integration of this chip make it suitable for a wide range of applications across various industries.
MAX389EWG Relevant information