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MAX389CWG

MAX389CWG

Manufacturer No:

MAX389CWG

Description:

IC SWITCH SP4T X 2 3KOHM 24SOIC

Datasheet:

Datasheet

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MAX389CWG Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-SOIC
  • Package / Case
    24-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 25pF
  • Charge Injection
    55pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    1.5µs, 1µs
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 18V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    300Ohm
  • On-State Resistance (Max)
    3kOhm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The M2S090-1FCS325 is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090-1FCS325 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S090-1FCS325 chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling the chip to handle complex tasks and real-time applications.Application scenarios: 1. Industrial automation: The M2S090-1FCS325 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization of interfaces and protocols, while the microcontroller subsystem handles control and communication tasks. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller capabilities, the chip can be used in IoT devices that require both hardware flexibility and software programmability. It can handle sensor data processing, communication protocols, and security features. 3. Aerospace and defense: The M2S090-1FCS325 chip's security features make it suitable for aerospace and defense applications that require protection against tampering or unauthorized access. It can be used in avionics systems, secure communication devices, or military-grade equipment. 4. Medical devices: The chip's low power consumption and high-performance capabilities make it suitable for medical devices such as patient monitoring systems, portable diagnostic equipment, or implantable devices. 5. Communications: The M2S090-1FCS325 chip can be used in communication systems that require high-speed data processing, protocol handling, and encryption. It can be utilized in network switches, routers, or secure communication devices.These are just a few examples of the advantages and application scenarios of the M2S090-1FCS325 chip. Its versatility, integration, security features, low power consumption, and high performance make it suitable for a wide range of applications in various industries.
MAX389CWG Relevant information