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MAX383BEPE

MAX383BEPE

Manufacturer No:

MAX383BEPE

Description:

IC SWITCH SPDT X 2 35OHM 16DIP

Datasheet:

Datasheet

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MAX383BEPE Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -90dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    200pA
  • Channel Capacitance (CS(off), CD(off))
    12pF, 12pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 100ns
  • Voltage - Supply, Dual (V±)
    ±3V ~ 8V
  • Voltage - Supply, Single (V+)
    3V ~ 15V
  • Channel-to-Channel Matching (ΔRon)
    500mOhm
  • On-State Resistance (Max)
    35Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    -
The M2S150T-1FCVG484 is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S150T-1FCVG484 IC chip:Advantages: 1. Versatility: The M2S150T-1FCVG484 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, into a single device. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S150T-1FCVG484, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications requiring high levels of security. 4. Low power consumption: The M2S150T-1FCVG484 chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 5. High performance: With a combination of FPGA fabric and a 100 MHz ARM Cortex-M3 processor, the chip offers high-performance computing capabilities.Application Scenarios: 1. Industrial Automation: The M2S150T-1FCVG484 chip can be used in industrial automation applications such as motor control, robotics, and process control. Its FPGA fabric allows for real-time customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): The chip's low power consumption, security features, and integration make it suitable for IoT applications. It can be used in smart home devices, sensor networks, and edge computing systems. 3. Aerospace and Defense: The M2S150T-1FCVG484 chip's security features, high performance, and radiation tolerance (depending on the specific variant) make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, and military-grade equipment. 4. Medical Devices: The chip's integration, low power consumption, and security features make it suitable for medical device applications. It can be used in patient monitoring systems, medical imaging devices, and portable medical equipment. 5. Communications: The M2S150T-1FCVG484 chip can be used in communication systems such as routers, switches, and network appliances. Its FPGA fabric allows for customization and optimization of networking protocols and algorithms.These are just a few examples of the advantages and application scenarios of the M2S150T-1FCVG484 IC chip. The specific use cases may vary depending on the requirements and design considerations of the target application.
MAX383BEPE Relevant information