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MAX378EWG

MAX378EWG

Manufacturer No:

MAX378EWG

Description:

IC MUX 8:1 3.5KOHM 24SOIC

Datasheet:

Datasheet

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MAX378EWG Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-SOIC
  • Package / Case
    24-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 25pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    400ns, 300ns (Typ)
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 18V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    3.5kOhm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The M2S050TS-1FGG484 is an integrated circuit chip from Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S050TS-1FGG484 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 processor core. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, processor, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and secure key storage. This makes the M2S050TS-1FGG484 chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 processor provide high-performance computing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S050TS-1FGG484 chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization of I/O interfaces and real-time processing, while the processor core handles control and communication tasks. 2. Internet of Things (IoT): With its low power consumption and security features, the chip is suitable for IoT applications. It can be used in edge devices for data processing, sensor integration, and secure communication. 3. Aerospace and defense: The M2S050TS-1FGG484 chip's security features make it suitable for aerospace and defense applications that require protection against tampering and secure booting. It can be used in avionics systems, secure communication devices, and military-grade equipment. 4. Medical devices: The chip's versatility and integration make it suitable for medical devices like patient monitoring systems, diagnostic equipment, and portable medical devices. The FPGA fabric can be used for signal processing and customization, while the processor core handles data management and communication. 5. Communications: The chip can be used in communication systems, such as routers, switches, and network appliances. The FPGA fabric allows for customization of interfaces and protocols, while the processor core handles control and management tasks.These are just a few examples of the advantages and application scenarios of the M2S050TS-1FGG484 chip. Its versatility, integration, security features, low power consumption, and high performance make it suitable for a wide range of applications in various industries.
MAX378EWG Relevant information