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MAX378EPE

MAX378EPE

Manufacturer No:

MAX378EPE

Description:

IC MUX 8:1 3.5KOHM 16DIP

Datasheet:

Datasheet

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MAX378EPE Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 25pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    400ns, 300ns (Typ)
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 18V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    3.5kOhm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The M2S050T-1FGG484I is an integrated circuit chip from Microsemi, which belongs to their SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S050T-1FGG484I chip combines an FPGA fabric with a hard ARM Cortex-M3 microcontroller, offering the benefits of both programmable logic and microprocessor capabilities in a single device. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, reducing the need for external components and simplifying system design. 3. Security: SmartFusion2 devices provide built-in security features, such as secure boot, tamper detection, and bitstream encryption, making them suitable for applications requiring high levels of security. 4. Low power consumption: The chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications. 5. High reliability: SmartFusion2 devices are known for their reliability and robustness, making them suitable for applications that require high levels of reliability and fault tolerance.Application scenarios: 1. Industrial automation: The M2S050T-1FGG484I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols implementation. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller capabilities, the chip can be used in IoT devices for tasks such as data processing, connectivity, and security. 3. Aerospace and defense: The chip's security features, reliability, and fault tolerance make it suitable for aerospace and defense applications, including avionics, secure communication systems, and military-grade equipment. 4. Medical devices: The chip can be used in medical devices for tasks such as signal processing, data acquisition, and control algorithms implementation. 5. Automotive: The M2S050T-1FGG484I chip can be used in automotive applications for tasks such as advanced driver assistance systems (ADAS), infotainment systems, and vehicle control units.These are just a few examples, and the versatility of the chip allows it to be used in various other application scenarios where a combination of FPGA and microcontroller capabilities is required.
MAX378EPE Relevant information