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MAX369CWN

MAX369CWN

Manufacturer No:

MAX369CWN

Description:

IC SWITCH SP4TX2 1.8KOHM 18SOIC

Datasheet:

Datasheet

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MAX369CWN Specifications

  • Type
    Parameter
  • Supplier Device Package
    18-SOIC
  • Package / Case
    18-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    5nA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 12pF
  • Charge Injection
    55pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    1.5µs, 1µs
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 18V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    180Ohm
  • On-State Resistance (Max)
    1.8kOhm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The M2S010-TQG144 is an integrated circuit chip from Microsemi, which belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S010-TQG144 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and bitstream encryption. These features enhance the security of the system and protect against unauthorized access or tampering. 4. Low power consumption: The M2S010-TQG144 chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S010-TQG144 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization of I/O interfaces and real-time processing, while the microcontroller subsystem handles control and communication tasks. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller, the chip is well-suited for IoT applications. It can be used for edge computing, sensor data processing, and connectivity protocols, enabling intelligent and efficient IoT devices. 3. Aerospace and defense: The M2S010-TQG144 chip's security features make it suitable for aerospace and defense applications. It can be used in secure communication systems, avionics, or military-grade embedded systems. 4. Medical devices: The chip's low power consumption and high performance make it suitable for medical devices such as patient monitoring systems, portable diagnostic devices, or implantable devices. 5. Communications: The M2S010-TQG144 chip can be used in communication systems, including wired or wireless infrastructure equipment, network switches, or routers. The FPGA fabric allows for customization of communication protocols, while the microcontroller subsystem handles control and management tasks.These are just a few examples of the advantages and application scenarios of the M2S010-TQG144 chip. The versatility and integration of this chip make it suitable for a wide range of applications where both hardware customization and software programmability are required.
MAX369CWN Relevant information