MAX369CPN

MAX369CPN

Manufacturer No:

MAX369CPN

Description:

IC SWITCH SP4T X 2 1.8KOHM 18DIP

Datasheet:

Datasheet

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MAX369CPN Specifications

  • Type
    Parameter
  • Supplier Device Package
    18-PDIP
  • Package / Case
    18-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    5nA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 12pF
  • Charge Injection
    55pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    1.5µs, 1µs
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 18V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    180Ohm
  • On-State Resistance (Max)
    1.8kOhm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XCZU9EG-2FFVB1156I is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. These chips combine a high-performance processing system with programmable logic, making them suitable for a wide range of applications. Here are some advantages and application scenarios of the XCZU9EG-2FFVB1156I:Advantages: 1. High-performance processing: The XCZU9EG-2FFVB1156I chip features a quad-core ARM Cortex-A53 processor, a dual-core ARM Cortex-R5 real-time processor, and an ARM Mali-400 MP2 GPU. This combination provides high-performance processing capabilities for demanding applications.2. Programmable logic: The chip also includes programmable logic resources, allowing users to implement custom hardware accelerators or interface with external devices. This flexibility enables the chip to be tailored to specific application requirements.3. Integrated peripherals: The XCZU9EG-2FFVB1156I chip includes a wide range of integrated peripherals such as USB, Ethernet, PCIe, and DDR memory controllers. These peripherals simplify system design and reduce the need for additional external components.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for power-constrained applications.Application scenarios: 1. Embedded systems: The XCZU9EG-2FFVB1156I chip is commonly used in embedded systems that require high-performance processing and programmable logic capabilities. It can be used in applications such as industrial automation, robotics, and automotive systems.2. High-performance computing: The chip's processing capabilities make it suitable for high-performance computing applications, including data centers, cloud computing, and scientific research.3. Video and image processing: The integrated GPU and programmable logic resources make the chip well-suited for video and image processing applications. It can be used in areas such as video surveillance, medical imaging, and computer vision.4. Wireless communication: The chip's integrated peripherals and processing capabilities make it suitable for wireless communication applications. It can be used in wireless base stations, software-defined radios, and IoT gateways.Overall, the XCZU9EG-2FFVB1156I chip offers a combination of high-performance processing, programmable logic, and integrated peripherals, making it versatile for a wide range of applications.