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MAX365EPE

MAX365EPE

Manufacturer No:

MAX365EPE

Description:

IC SWITCH SPST-NOX4 85OHM 16DIP

Datasheet:

Datasheet

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MAX365EPE Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -100dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    4pF, 4pF
  • Charge Injection
    5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    250ns, 120ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    10V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    2Ohm (Max)
  • On-State Resistance (Max)
    85Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XCZU4CG-1FBVB900E is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ family and offers several advantages and application scenarios:Advantages: 1. High-performance processing: The XCZU4CG-1FBVB900E chip combines a processing system (ARM Cortex-A53) with programmable logic (FPGA) to provide high-performance processing capabilities. 2. Programmability: Being an FPGA-based chip, it allows for reprogramming and customization of hardware functionality, making it suitable for a wide range of applications. 3. Integration: The chip integrates multiple components, including processors, memory, and programmable logic, reducing the need for external components and simplifying system design. 4. Power efficiency: The XCZU4CG-1FBVB900E chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. 5. Scalability: The Zynq UltraScale+ family offers different chip models with varying capabilities, allowing for scalability based on application requirements.Application Scenarios: 1. Embedded Systems: The XCZU4CG-1FBVB900E chip is commonly used in embedded systems where high-performance processing and programmability are required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Software-Defined Networking (SDN): The chip's programmable logic can be utilized to implement networking functions, making it suitable for SDN applications that require flexibility and customization. 3. Video and Image Processing: The XCZU4CG-1FBVB900E chip's processing capabilities, combined with its programmable logic, make it suitable for video and image processing applications, including real-time video analytics, computer vision, and multimedia systems. 4. High-Performance Computing (HPC): The chip's high-performance processing and programmability make it suitable for HPC applications, such as scientific simulations, data analytics, and machine learning. 5. Aerospace and Defense: The XCZU4CG-1FBVB900E chip's integration, power efficiency, and high-performance processing make it suitable for aerospace and defense applications, including radar systems, communication systems, and avionics.It's important to note that the specific application scenarios may vary based on the system requirements and the capabilities of the XCZU4CG-1FBVB900E chip.
MAX365EPE Relevant information