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MAX364EPE

MAX364EPE

Manufacturer No:

MAX364EPE

Description:

IC SWITCH SPST-NCX4 85OHM 16DIP

Datasheet:

Datasheet

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MAX364EPE Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -100dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    4pF, 4pF
  • Charge Injection
    5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    250ns, 120ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    10V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    2Ohm (Max)
  • On-State Resistance (Max)
    85Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The M2S060TS-FGG484 integrated circuit chip is a specific model of the Microsemi SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S060TS-FGG484 chip combines an FPGA fabric with a hard ARM Cortex-M3 processor, offering the flexibility of programmable logic and the processing power of a microcontroller in a single device. 2. Integration: The chip integrates various peripherals, including UART, SPI, I2C, GPIO, timers, and memory controllers, reducing the need for external components and simplifying system design. 3. Security: SmartFusion2 devices provide built-in security features, such as secure boot, tamper detection, and bitstream encryption, making them suitable for applications requiring high levels of security. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High reliability: SmartFusion2 devices are known for their high reliability and robustness, making them suitable for applications that require long-term operation in harsh environments.Application scenarios: 1. Industrial automation: The M2S060TS-FGG484 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols implementation. 2. Internet of Things (IoT): With its combination of programmable logic and a microcontroller, the chip is suitable for IoT applications that require both processing power and flexibility, such as edge computing, sensor networks, and gateway devices. 3. Aerospace and defense: The chip's security features, reliability, and low power consumption make it suitable for aerospace and defense applications, including avionics, secure communication systems, and military-grade equipment. 4. Medical devices: The chip's integration of peripherals and low power consumption make it suitable for medical devices, such as patient monitoring systems, portable diagnostic equipment, and implantable devices. 5. Communications: The chip can be used in communication systems, such as routers, switches, and network appliances, for tasks like packet processing, protocol implementation, and encryption/decryption.These are just a few examples, and the versatility of the M2S060TS-FGG484 chip allows it to be used in various other application scenarios where a combination of programmable logic and a microcontroller is required.
MAX364EPE Relevant information