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MAX362EPE

MAX362EPE

Manufacturer No:

MAX362EPE

Description:

IC SWITCH SPST-NOX4 85OHM 16DIP

Datasheet:

Datasheet

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MAX362EPE Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -100dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    4pF, 4pF
  • Charge Injection
    5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    250ns, 120ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    10V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    2Ohm (Max)
  • On-State Resistance (Max)
    85Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The M2S060T-1FGG484 integrated circuit chip is a member of the SmartFusion2 family of system-on-chip (SoC) devices developed by Microsemi Corporation. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S060T-1FGG484 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S060T-1FGG484 chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling the chip to handle complex tasks and applications.Application scenarios: 1. Industrial automation: The M2S060T-1FGG484 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization of I/O interfaces and real-time processing, while the microcontroller subsystem can handle control algorithms and communication protocols. 2. Internet of Things (IoT): The chip can be used in IoT devices that require both hardware flexibility and software programmability. It can be used for sensor data processing, connectivity, and edge computing tasks. 3. Aerospace and defense: The M2S060T-1FGG484 chip's security features make it suitable for aerospace and defense applications that require protection against tampering and secure boot capabilities. It can be used in avionics systems, secure communication devices, and military-grade equipment. 4. Medical devices: The chip can be used in medical devices that require real-time processing, connectivity, and security. It can be used in applications such as patient monitoring systems, medical imaging devices, and portable medical equipment. 5. Communications: The chip's FPGA fabric can be used for protocol conversion, signal processing, and high-speed data handling in communication systems. The microcontroller subsystem can handle control and management tasks in these applications.These are just a few examples of the advantages and application scenarios of the M2S060T-1FGG484 integrated circuit chip. The versatility and integration of this chip make it suitable for a wide range of applications across various industries.
MAX362EPE Relevant information