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MAX358EPE

MAX358EPE

Manufacturer No:

MAX358EPE

Description:

IC MUX 8:1 1.8KOHM 16DIP

Datasheet:

Datasheet

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MAX358EPE Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    10µA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 25pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    300ns, 300ns (Typ)
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 18V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    1.8kOhm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XCZU7EV-1FBVB900EES9 is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ family and offers several advantages and application scenarios. Here are some key points:Advantages: 1. High-performance processing: The XCZU7EV-1FBVB900EES9 chip combines a processing system (ARM Cortex-A53) with programmable logic (FPGA) to provide high-performance processing capabilities. 2. Versatility: The chip's programmable logic allows for customization and flexibility, making it suitable for a wide range of applications. 3. Power efficiency: The XCZU7EV-1FBVB900EES9 chip is designed to be power-efficient, enabling longer battery life and reduced power consumption in applications. 4. Integration: It integrates multiple components, including processing cores, programmable logic, memory interfaces, and various peripherals, reducing the need for external components and simplifying system design.Application Scenarios: 1. Embedded Systems: The XCZU7EV-1FBVB900EES9 chip is commonly used in embedded systems where high-performance processing and flexibility are required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Edge Computing: With its processing power and programmable logic, the chip is suitable for edge computing applications. It can handle real-time data processing, machine learning, and AI algorithms at the edge of the network. 3. Communications: The XCZU7EV-1FBVB900EES9 chip can be used in communication systems, including wireless base stations, routers, and network switches, to handle high-speed data processing and protocol handling. 4. Video and Image Processing: The chip's capabilities make it suitable for video and image processing applications, such as video surveillance, medical imaging, and multimedia systems. 5. High-Performance Computing: The XCZU7EV-1FBVB900EES9 chip can be utilized in high-performance computing environments, including scientific research, data centers, and cloud computing, to accelerate complex computations and simulations.It's important to note that the specific use cases and advantages may vary depending on the requirements and implementation of the application.
MAX358EPE Relevant information