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MAX352EPE

MAX352EPE

Manufacturer No:

MAX352EPE

Description:

IC SWITCH SPST-NOX4 35OHM 16DIP

Datasheet:

Datasheet

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MAX352EPE Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    9pF, 9pF
  • Charge Injection
    5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 145ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    10V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    2Ohm (Max)
  • On-State Resistance (Max)
    35Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The M2S150-FCVG484I is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of the M2S150-FCVG484I IC chip:Advantages: 1. Versatility: The M2S150-FCVG484I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, into a single device. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S150-FCVG484I, provides advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require robust security measures. 4. Low power consumption: The M2S150-FCVG484I chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 5. High performance: With a combination of FPGA fabric and a powerful ARM Cortex-M3 processor, the chip offers high-performance computing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S150-FCVG484I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and real-time data processing. Its FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its low power consumption and integration of FPGA and microcontroller, the chip can be used in IoT devices for edge computing, sensor data processing, and secure communication. 3. Aerospace and defense: The M2S150-FCVG484I chip's security features, high performance, and integration make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, and military-grade embedded systems. 4. Medical devices: The chip's versatility and security features make it suitable for medical devices such as patient monitoring systems, medical imaging equipment, and portable diagnostic devices. 5. Communications and networking: The M2S150-FCVG484I chip can be used in networking equipment, routers, and switches for high-performance packet processing, encryption, and network security.These are just a few examples of the advantages and application scenarios of the M2S150-FCVG484I IC chip. The specific usage depends on the requirements and design considerations of the target application.
MAX352EPE Relevant information