MAX351EPE

MAX351EPE

Manufacturer No:

MAX351EPE

Description:

IC SWITCH SPST-NCX4 35OHM 16DIP

Datasheet:

Datasheet

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MAX351EPE Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    250pA
  • Channel Capacitance (CS(off), CD(off))
    9pF, 9pF
  • Charge Injection
    5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 145ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    10V ~ 30V
  • Channel-to-Channel Matching (ΔRon)
    2Ohm (Max)
  • On-State Resistance (Max)
    35Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XCZU4EV-1SFVC784E is a specific model of the Xilinx Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family. This integrated circuit chip offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the XCZU4EV-1SFVC784E are:Advantages: 1. High Performance: The XCZU4EV-1SFVC784E chip combines a powerful Arm Cortex-A53 quad-core processor with programmable logic, providing high-performance processing capabilities. 2. Programmable Logic: The chip includes programmable logic resources, allowing users to implement custom hardware accelerators, interfaces, and other specialized functions. 3. Heterogeneous Processing: The combination of Arm processors and programmable logic enables heterogeneous processing, where tasks can be offloaded to the most suitable processing element for optimal performance and power efficiency. 4. Integrated Peripherals: The chip includes a wide range of integrated peripherals such as USB, Ethernet, PCIe, and DDR memory controllers, reducing the need for additional external components. 5. Low Power Consumption: The XCZU4EV-1SFVC784E chip is designed to be power-efficient, making it suitable for applications with strict power constraints.Application Scenarios: 1. Embedded Systems: The XCZU4EV-1SFVC784E chip is commonly used in embedded systems where high-performance processing and programmable logic are required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Edge Computing: With its heterogeneous processing capabilities, the chip is well-suited for edge computing applications. It can perform real-time data processing and analysis at the edge, reducing the need for data transmission to the cloud. 3. Video Processing: The XCZU4EV-1SFVC784E chip's high-performance processing and programmable logic make it suitable for video processing applications. It can be used in video surveillance systems, video analytics, and video transcoding. 4. Wireless Communication: The chip's integrated peripherals and processing capabilities make it suitable for wireless communication applications. It can be used in base stations, software-defined radios, and wireless network infrastructure. 5. High-Performance Computing: The XCZU4EV-1SFVC784E chip's combination of processors and programmable logic makes it suitable for high-performance computing applications. It can be used in areas such as scientific research, data centers, and cloud computing.These are just a few examples of the advantages and application scenarios of the XCZU4EV-1SFVC784E chip. Its flexibility, performance, and power efficiency make it a versatile solution for a wide range of applications.