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MAX350CWN

MAX350CWN

Manufacturer No:

MAX350CWN

Description:

IC SWITCH SP4T X 2 100OHM 18SOIC

Datasheet:

Datasheet

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MAX350CWN Specifications

  • Type
    Parameter
  • Supplier Device Package
    18-SOIC
  • Package / Case
    18-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -90dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    2pF, 2pF
  • Charge Injection
    1pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    275ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±2.7V ~ 8V
  • Voltage - Supply, Single (V+)
    2.7V ~ 16V
  • Channel-to-Channel Matching (ΔRon)
    16Ohm (Max)
  • On-State Resistance (Max)
    100Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XC7Z045-2FFG900CES is a specific model of integrated circuit chip from Xilinx, which belongs to the Zynq-7000 family of devices. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XC7Z045-2FFG900CES chip combines a dual-core ARM Cortex-A9 processor with programmable logic, providing high-performance processing capabilities. 2. Programmable logic: The chip includes programmable logic resources, allowing users to implement custom hardware accelerators, interfaces, and other functionalities. 3. System integration: It offers a high level of system integration by combining processing and programmable logic on a single chip, reducing the need for external components and improving overall system efficiency. 4. Flexibility: The chip's programmable logic allows for flexibility in design iterations, making it suitable for applications that require frequent updates or customization. 5. Power efficiency: The XC7Z045-2FFG900CES chip is designed to be power-efficient, making it suitable for applications with strict power constraints.Application scenarios: 1. Embedded systems: The chip is commonly used in embedded systems where a combination of processing power and programmable logic is required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. High-performance computing: The XC7Z045-2FFG900CES chip's processing capabilities make it suitable for high-performance computing applications, including data centers, cloud computing, and scientific research. 3. Software-defined networking: The chip's programmable logic can be utilized to implement custom networking functionalities, making it suitable for software-defined networking applications. 4. Video and image processing: The high-performance processing capabilities of the chip make it suitable for video and image processing applications, including video surveillance, medical imaging, and multimedia systems. 5. Internet of Things (IoT): The XC7Z045-2FFG900CES chip's combination of processing power and programmable logic makes it suitable for IoT applications that require both edge processing and connectivity.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of a particular project.
MAX350CWN Relevant information