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MM74HC4053WM Specifications
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TypeParameter
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Supplier Device Package16-SOIC
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Package / Case16-SOIC (0.295", 7.50mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Crosstalk-50dB @ 1MHz
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Current - Leakage (IS(off)) (Max)100nA
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Channel Capacitance (CS(off), CD(off))5pF, 30pF
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Charge Injection-
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-3db Bandwidth35MHz
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Switch Time (Ton, Toff) (Max)41ns, 32ns
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Voltage - Supply, Dual (V±)±2V ~ 6V
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Voltage - Supply, Single (V+)2V ~ 6V
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Channel-to-Channel Matching (ΔRon)15Ohm
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On-State Resistance (Max)100Ohm
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Number of Circuits3
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Multiplexer/Demultiplexer Circuit2:1
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Switch CircuitSPDT
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PackagingTube
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Product StatusObsolete
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Series-
The XCVC1802-1LSEVSVD1760 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The XCVC1802-1LSEVSVD1760 chips are designed to deliver high performance with low power consumption, making them suitable for a wide range of applications. 2. Versatility: These chips are highly versatile and can be used in various applications, including industrial automation, automotive, consumer electronics, and telecommunications. 3. Advanced Features: The chips offer advanced features such as high-speed data processing, low latency, and high bandwidth, enabling efficient and reliable operation. 4. Scalability: The XCVC1802-1LSEVSVD1760 chips are scalable, allowing for easy integration into different systems and enabling future upgrades and enhancements. 5. Security: These chips provide robust security features, including encryption and authentication, ensuring the protection of sensitive data.Application Scenarios: 1. Industrial Automation: The XCVC1802-1LSEVSVD1760 chips can be used in industrial automation systems for real-time control, data processing, and communication, enabling efficient and reliable operation of manufacturing processes. 2. Automotive: These chips find applications in automotive systems such as advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs), providing high-performance computing and connectivity capabilities. 3. Consumer Electronics: The chips can be used in various consumer electronics devices, including smartphones, tablets, and smart home devices, enabling fast and efficient data processing, multimedia capabilities, and connectivity. 4. Telecommunications: The XCVC1802-1LSEVSVD1760 chips are suitable for telecommunications infrastructure, including routers, switches, and base stations, providing high-speed data processing and low latency for efficient network operations. 5. Data Centers: These chips can be used in data centers for high-performance computing, storage, and networking, enabling efficient data processing and handling large workloads.Overall, the XCVC1802-1LSEVSVD1760 integrated circuit chips offer high performance, versatility, and advanced features, making them suitable for a wide range of applications in various industries.
MM74HC4053WM Relevant information
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