Home / Analog Switches, Multiplexers, Demultiplexers / NX3L1G3157GM,115/
NX3L1G3157GM,115

NX3L1G3157GM,115

Manufacturer No:

NX3L1G3157GM,115

Manufacturer:

NXP USA Inc.

Description:

IC SWITCH SPDT X 1 750MOHM 6XSON

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

NX3L1G3157GM,115 Specifications

  • Type
    Parameter
  • Supplier Device Package
    6-XSON, SOT886 (1.45x1)
  • Package / Case
    6-XFDFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    10nA
  • Channel Capacitance (CS(off), CD(off))
    35pF
  • Charge Injection
    15pC
  • -3db Bandwidth
    60MHz
  • Switch Time (Ton, Toff) (Max)
    25ns, 10ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.4V ~ 4.3V
  • Channel-to-Channel Matching (ΔRon)
    20mOhm
  • On-State Resistance (Max)
    750mOhm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The NX3L1G3157GM,115 is a specific integrated circuit chip, but as an AI language model, I don't have real-time access to the latest product information. However, I can provide you with some general information about integrated circuit chips.Integrated circuit chips, also known as IC chips or simply ICs, are widely used in various electronic devices. They offer several advantages, including:1. Miniaturization: IC chips are compact and can contain thousands or even millions of electronic components on a single chip, allowing for smaller and more portable devices.2. Improved performance: IC chips can provide faster processing speeds, higher data storage capacities, and improved power efficiency compared to discrete electronic components.3. Reliability: The integration of components on a single chip reduces the number of interconnections, minimizing the risk of loose connections or failures due to external factors like temperature or vibration.4. Cost-effectiveness: Mass production of IC chips reduces manufacturing costs, making them more affordable for a wide range of applications.As for the specific application scenarios of the NX3L1G3157GM,115 chip, I don't have the details on its specific features or recommended uses. To understand its advantages and application scenarios, it would be best to refer to the datasheet or technical documentation provided by the manufacturer or consult with an electronics expert familiar with the chip.
NX3L1G3157GM,115 Relevant information