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74HC4067DB,118

74HC4067DB,118

Manufacturer No:

74HC4067DB,118

Manufacturer:

Nexperia USA Inc.

Description:

IC MUX 16:1 120OHM 24SSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74HC4067DB,118 Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-SSOP
  • Package / Case
    24-SSOP (0.209", 5.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    100nA
  • Channel Capacitance (CS(off), CD(off))
    3.5pF
  • Charge Injection
    -
  • -3db Bandwidth
    100MHz
  • Switch Time (Ton, Toff) (Max)
    45ns, 45ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    2V ~ 10V
  • Channel-to-Channel Matching (ΔRon)
    6Ohm
  • On-State Resistance (Max)
    120Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    16:1
  • Switch Circuit
    -
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The BCM53570B0KFSBG is a specific model of integrated circuit chip developed by Broadcom. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for the BCM53570B0KFSBG:Advantages: 1. High Performance: The BCM53570B0KFSBG chip is designed to deliver high-performance networking capabilities, making it suitable for demanding applications. 2. Integration: It integrates multiple functions and features into a single chip, reducing the need for additional components and simplifying the overall system design. 3. Power Efficiency: The chip is designed to be power-efficient, helping to reduce energy consumption and extend battery life in portable devices. 4. Scalability: The chip offers scalability options, allowing it to be used in a wide range of applications, from small-scale deployments to large-scale enterprise networks. 5. Security: The BCM53570B0KFSBG chip incorporates security features to help protect against various threats and vulnerabilities, ensuring data integrity and privacy.Application Scenarios: 1. Enterprise Networking: The chip can be used in enterprise networking equipment such as routers, switches, and access points, providing high-speed connectivity and advanced networking features. 2. Data Centers: The chip's high-performance capabilities make it suitable for data center applications, enabling efficient data processing, storage, and networking. 3. Internet of Things (IoT): With its power efficiency and integration capabilities, the chip can be used in IoT devices, enabling connectivity and communication between various IoT devices and systems. 4. Smart Home Automation: The chip can be utilized in smart home automation systems, enabling seamless connectivity and control of various smart devices and appliances. 5. Wireless Infrastructure: The chip can be employed in wireless infrastructure equipment, such as base stations and access points, to provide reliable and high-speed wireless connectivity.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and implementation of the chip in a particular system or product.
74HC4067DB,118 Relevant information