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74HC4053DB,112

74HC4053DB,112

Manufacturer No:

74HC4053DB,112

Manufacturer:

Nexperia USA Inc.

Description:

IC SWITCH SPDT X 3 120OHM 16SSOP

Datasheet:

Datasheet

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74HC4053DB,112 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SSOP
  • Package / Case
    16-SSOP (0.209", 5.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -60dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100nA
  • Channel Capacitance (CS(off), CD(off))
    3.5pF
  • Charge Injection
    -
  • -3db Bandwidth
    170MHz
  • Switch Time (Ton, Toff) (Max)
    31ns, 29ns
  • Voltage - Supply, Dual (V±)
    ±1.5V ~ 5V
  • Voltage - Supply, Single (V+)
    2V ~ 10V
  • Channel-to-Channel Matching (ΔRon)
    6Ohm
  • On-State Resistance (Max)
    120Ohm
  • Number of Circuits
    3
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Tube
  • Packaging
    Bulk
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    -
The XCZU3EG-1SBVA484I is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XCZU3EG-1SBVA484I chip combines a processing system (ARM Cortex-A53) with programmable logic (FPGA) to provide high-performance processing capabilities. This allows for efficient execution of complex algorithms and tasks. 2. Versatility: The chip offers a combination of processing, programmable logic, and various I/O interfaces, making it suitable for a wide range of applications. 3. Power efficiency: The XCZU3EG-1SBVA484I chip is designed to be power-efficient, enabling longer battery life in portable devices or reducing power consumption in embedded systems. 4. Scalability: The chip provides scalability options, allowing users to choose the appropriate level of performance and resources based on their application requirements.Application scenarios: 1. Embedded systems: The XCZU3EG-1SBVA484I chip is commonly used in embedded systems where a combination of processing power and programmable logic is required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. High-performance computing: The chip's FPGA fabric and processing system make it suitable for high-performance computing applications. It can be used in areas like data centers, scientific research, and signal processing. 3. Video and image processing: The XCZU3EG-1SBVA484I chip's high-performance processing capabilities make it well-suited for video and image processing applications. It can be used in video surveillance systems, medical imaging, and multimedia devices. 4. Wireless communication: The chip's integrated processing system and programmable logic can be utilized in wireless communication systems, including base stations, software-defined radios, and wireless networking equipment.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design choices made by the user.
74HC4053DB,112 Relevant information