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ISL43145IVZ

ISL43145IVZ

Manufacturer No:

ISL43145IVZ

Manufacturer:

Intersil

Description:

IC SW SPST-NO/NCX4 25OHM 16TSSOP

Datasheet:

Datasheet

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ISL43145IVZ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -89dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    10pF, 26pF
  • Charge Injection
    5pC (Max)
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    65ns, 50ns
  • Voltage - Supply, Dual (V±)
    ±2.6V ~ 6V
  • Voltage - Supply, Single (V+)
    2.7V ~ 12V
  • Channel-to-Channel Matching (ΔRon)
    500mOhm
  • On-State Resistance (Max)
    25Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The XCZU2EG-1UBVA530I is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some of them:Advantages: 1. Versatility: The XCZU2EG-1UBVA530I is a highly versatile chip that combines a processing system (PS) with programmable logic (PL) in a single device. This integration allows for flexible and efficient implementation of a wide range of applications. 2. High-performance processing: The chip features a dual-core Arm Cortex-A53 processor, which provides high-performance processing capabilities for running complex software applications. 3. Programmable logic: The programmable logic section of the chip allows for the implementation of custom hardware accelerators, digital signal processing (DSP) functions, and other specialized hardware components. This flexibility enables the chip to be tailored to specific application requirements. 4. FPGA fabric: The FPGA fabric in the chip provides a reconfigurable hardware platform that can be dynamically programmed to perform various tasks. This allows for rapid prototyping, design iteration, and system-level integration. 5. High-speed interfaces: The XCZU2EG-1UBVA530I supports various high-speed interfaces, including PCIe, Ethernet, USB, and DDR4 memory interfaces. These interfaces enable seamless connectivity with external devices and systems.Application scenarios: 1. Embedded systems: The XCZU2EG-1UBVA530I is well-suited for embedded system applications that require a combination of processing power and programmable logic. It can be used in areas such as industrial automation, robotics, automotive systems, and aerospace. 2. Software-defined networking (SDN): The chip's high-performance processing capabilities make it suitable for SDN applications, where it can handle complex networking tasks and protocol processing. 3. High-performance computing (HPC): The XCZU2EG-1UBVA530I can be used in HPC applications that require both high-performance processing and customizable hardware acceleration. It can be utilized for tasks like data analytics, scientific simulations, and machine learning. 4. Video and image processing: The chip's FPGA fabric and high-speed interfaces make it ideal for video and image processing applications. It can be used for tasks like video transcoding, image recognition, and real-time video analytics. 5. Wireless communication: The XCZU2EG-1UBVA530I can be employed in wireless communication systems, including 5G base stations, where it can handle signal processing, protocol implementation, and baseband processing.These are just a few examples of the advantages and application scenarios of the XCZU2EG-1UBVA530I IC chip. Its versatility, high-performance processing, and programmable logic capabilities make it suitable for a wide range of applications in various industries.
ISL43145IVZ Relevant information