MAX314FESE

MAX314FESE

Manufacturer No:

MAX314FESE

Description:

IC SW SPST-NO/NCX4 10OHM 16SOIC

Datasheet:

Datasheet

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MAX314FESE Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -104dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    20pF, 20pF
  • Charge Injection
    70pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    225ns, 185ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    9V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    50mOhm
  • On-State Resistance (Max)
    10Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO/NC
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The MC10EP58DTR2G is a specific integrated circuit chip, which is a member of the 10E series of high-speed emitter-coupled logic (ECL) devices. It has several advantages and application scenarios. Some of them are:Advantages: 1. High-speed performance: The MC10EP58DTR2G chip operates at very high speeds, making it suitable for applications requiring fast signal processing and data transmission. 2. Low power consumption: It is designed to operate at low power levels, helping to conserve energy in various electronic systems. 3. ECL technology: The chip uses ECL technology, which provides better noise immunity and higher noise margins compared to other logic families. 4. Wide temperature range: The MC10EP58DTR2G can operate over a wide temperature range, making it suitable for both commercial and industrial applications. 5. Small form factor: The chip is available in a compact package, enabling it to be easily integrated into different electronic devices and systems.Application Scenarios: 1. Telecommunications: The high-speed capabilities of the MC10EP58DTR2G make it suitable for use in telecommunications systems that require reliable and quick data transmission, such as high-speed modems, routers, and optical networking equipment. 2. Data communication and networking: The chip can be used in various networking applications, including data switches, routers, and high-speed data communication interfaces. 3. Test and measurement equipment: The MC10EP58DTR2G can be utilized in high-speed test and measurement equipment, such as oscilloscopes and logic analyzers, to process and analyze signals accurately and quickly. 4. Industrial equipment: Its wide temperature range and low power consumption make it suitable for use in industrial control systems, motor control, and automation systems, where reliability and efficiency are crucial. 5. High-speed computing: The chip can be employed in high-performance computing systems that involve data processing at very high speeds, such as supercomputers and high-frequency trading platforms.It's important to note that these advantages and scenarios are not exhaustive, and the MC10EP58DTR2G chip can have other applications depending on the specific requirements of a given electronic system.