HI3-5040-5

HI3-5040-5

Manufacturer No:

HI3-5040-5

Manufacturer:

Harris Corporation

Description:

IC SWITCH SPST X 1 75OHM 16DIP

Datasheet:

Datasheet

Delivery:

Payment:

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HI3-5040-5 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 75°C
  • Crosstalk
    -88dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    2nA
  • Channel Capacitance (CS(off), CD(off))
    11pF, 11pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    500ns, 500ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    15V
  • Channel-to-Channel Matching (ΔRon)
    2Ohm
  • On-State Resistance (Max)
    75Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The M2S025S-1FG484I is an integrated circuit chip from Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S025S-1FG484I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features like secure boot, tamper detection, and secure key storage. This makes the M2S025S-1FG484I chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex applications and real-time processing.Application scenarios: 1. Industrial automation: The M2S025S-1FG484I chip can be used in industrial automation applications, such as motor control, robotics, and process control. The FPGA fabric allows for custom hardware interfaces and real-time control, while the microcontroller subsystem can handle communication protocols and higher-level control algorithms. 2. Internet of Things (IoT): With its low power consumption and integration capabilities, the chip can be used in IoT devices, such as smart sensors, gateways, and edge computing devices. The FPGA fabric can be used for sensor interfacing and data preprocessing, while the microcontroller subsystem can handle communication protocols and data management. 3. Aerospace and defense: The security features of the SmartFusion2 family make the M2S025S-1FG484I chip suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, and military-grade equipment. 4. Medical devices: The chip's versatility and integration make it suitable for medical devices, such as patient monitoring systems, diagnostic equipment, and implantable devices. The FPGA fabric can be used for signal processing and customization, while the microcontroller subsystem can handle data acquisition and communication. 5. Automotive: The M2S025S-1FG484I chip can be used in automotive applications, such as advanced driver-assistance systems (ADAS), infotainment systems, and engine control units. The FPGA fabric can be used for sensor fusion and real-time control, while the microcontroller subsystem can handle communication interfaces and higher-level processing.These are just a few examples of the advantages and application scenarios of the M2S025S-1FG484I chip. The versatility and integration capabilities of this chip make it suitable for a wide range of applications across various industries.