HI303005
Manufacturer No:
HI303005
Manufacturer:
Description:
IC SWITCH SPST X 2 50OHM 14DIP
Datasheet:
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In Stock : 0
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HI303005 Specifications
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TypeParameter
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Supplier Device Package14-PDIP
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Package / Case14-DIP (0.300", 7.62mm)
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Mounting TypeThrough Hole
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Operating Temperature0°C ~ 70°C
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Crosstalk-
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Current - Leakage (IS(off)) (Max)5nA
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Channel Capacitance (CS(off), CD(off))16pF, 14pF
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Charge Injection-
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-3db Bandwidth-
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Switch Time (Ton, Toff) (Max)300ns, 250ns
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Voltage - Supply, Dual (V±)±15V
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Voltage - Supply, Single (V+)15V
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Channel-to-Channel Matching (ΔRon)-
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On-State Resistance (Max)50Ohm
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Number of Circuits2
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Multiplexer/Demultiplexer Circuit1:1
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Switch CircuitSPST
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PackagingBulk
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Product StatusActive
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Series-
The XCZU6EG-3FFVB1156E is a specific variant of the Xilinx Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family of integrated circuit (IC) chips. Here are the advantages and application scenarios of this particular chip:Advantages: 1. Powerful Processing Capability: The XCZU6EG-3FFVB1156E features a combination of programmable logic (FPGA) and application processing units (APUs) with ARM Cortex-A53 cores. This allows for highly flexible and versatile processing capabilities, enabling a wide range of applications. 2. Scalability: With a larger FPGA fabric and more processing units than lower variants, this chip offers increased scalability, making it suitable for applications requiring more computational resources. 3. High-Speed Connectivity: This chip integrates various high-speed interfaces such as Gigabit Ethernet, USB 3.0, PCIe Gen3, and multiple high-performance memory controllers, enabling fast data transfer and communication. 4. Versatile Programmable Logic: The FPGA fabric in the chip provides configurable logic blocks that can be programmed to implement custom hardware accelerators, protocols, or unique functionality, enhancing the chip's adaptability and performance. 5. Low Power Consumption: The XCZU6EG-3FFVB1156E incorporates power-saving features and advanced power management techniques to optimize energy efficiency, ensuring lower power consumption for battery-powered or energy-constrained applications.Application Scenarios: 1. Embedded Systems: The XCZU6EG-3FFVB1156E is well-suited for developing advanced embedded systems such as industrial automation, robotics, and smart city applications. Its powerful processing capabilities and versatility enable developers to implement complex algorithms and achieve real-time and high-performance computation. 2. High-Performance Computing: The chip's FPGA fabric can be utilized to accelerate computationally intensive workloads like cryptography, machine learning, video processing, and signal processing. The combination of programmable logic and processor cores allows for parallel execution and optimization of these applications. 3. Video or Image Processing: With its high-speed interfaces and powerful processing units, the XCZU6EG-3FFVB1156E can be used in video or image processing applications, including real-time video analytics, computer vision, and image recognition. The programmable logic can be leveraged to implement custom image processing algorithms or hardware accelerators. 4. Networking and Communication: The chip's built-in gigabit Ethernet and PCIe interfaces make it suitable for high-speed networking and communication equipment. It can be utilized in routers, switches, gateways, or other network appliances to handle advanced networking protocols and data processing tasks efficiently. 5. Aerospace and Defense: The XCZU6EG-3FFVB1156E's reliability, processing power, and low power consumption make it applicable for aerospace and defense applications such as avionics systems, radar processing, satellite communication, software-defined radios (SDR), and electronic warfare.Overall, the XCZU6EG-3FFVB1156E chip's advantages in processing capability, scalability, connectivity, programmable logic, and power consumption make it well-suited for a broad range of applications in various industries.
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