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HI3-0305-5

HI3-0305-5

Manufacturer No:

HI3-0305-5

Manufacturer:

Harris Corporation

Description:

IC SWITCH SPDT X 1 50OHM 14DIP

Datasheet:

Datasheet

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HI3-0305-5 Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-PDIP
  • Package / Case
    14-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 75°C
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    5nA
  • Channel Capacitance (CS(off), CD(off))
    16pF, 14pF
  • Charge Injection
    30pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    250ns, 150ns
  • Voltage - Supply, Dual (V±)
    ±22V
  • Voltage - Supply, Single (V+)
    44V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    50Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    1:2
  • Switch Circuit
    SPDT
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The M2S100TS-1FC1152I integrated circuit chips, also known as SmartFusion2 SoC FPGAs, have several advantages and application scenarios. Here are some of them:Advantages: 1. Integration: These chips combine a field-programmable gate array (FPGA) with a microcontroller subsystem (MSS) on a single chip. This integration allows for flexible hardware customization and software programmability in a single device. 2. Security: SmartFusion2 SoC FPGAs provide built-in security features, such as secure boot, tamper detection, and secure key storage. This makes them suitable for applications that require high levels of security, such as industrial control systems, defense, and aerospace. 3. Low power consumption: These chips are designed to be power-efficient, making them suitable for battery-powered devices or applications where power consumption is a concern. 4. High performance: SmartFusion2 SoC FPGAs offer high-performance processing capabilities, enabling them to handle complex tasks and real-time processing requirements. 5. Reliability: These chips are designed to be highly reliable, with features like error correction codes (ECC) and single-event upset (SEU) mitigation techniques. This makes them suitable for applications that require high reliability, such as medical devices and automotive systems.Application Scenarios: 1. Industrial Automation: SmartFusion2 SoC FPGAs can be used in industrial automation systems for tasks like motor control, sensor interfacing, and real-time monitoring. The integration of FPGA and MSS allows for customization and flexibility in implementing various industrial protocols and interfaces. 2. Internet of Things (IoT): These chips can be used in IoT devices for edge computing, data processing, and secure communication. The combination of FPGA and MSS enables the implementation of custom IoT protocols and algorithms. 3. Aerospace and Defense: SmartFusion2 SoC FPGAs are suitable for aerospace and defense applications due to their security features, reliability, and high-performance processing capabilities. They can be used in avionics systems, secure communication systems, and radar processing. 4. Medical Devices: These chips can be used in medical devices for tasks like signal processing, data encryption, and secure communication. The integration of FPGA and MSS allows for customization and adaptability to different medical protocols and standards. 5. Automotive: SmartFusion2 SoC FPGAs can be used in automotive systems for tasks like advanced driver-assistance systems (ADAS), infotainment systems, and secure communication. The security features and reliability of these chips make them suitable for automotive applications.These are just a few examples of the advantages and application scenarios of M2S100TS-1FC1152I integrated circuit chips. The versatility and flexibility of these chips make them suitable for a wide range of applications across various industries.
HI3-0305-5 Relevant information