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ADG222BQ

ADG222BQ

Manufacturer No:

ADG222BQ

Manufacturer:

Analog Devices Inc.

Description:

IC SW SPST-NCX4 90OHM 16CERDIP

Datasheet:

Datasheet

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ADG222BQ Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-CERDIP
  • Package / Case
    16-CDIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -80dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    2nA
  • Channel Capacitance (CS(off), CD(off))
    5pF, 5pF
  • Charge Injection
    20pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    300ns, 250ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    15V
  • Channel-to-Channel Matching (ΔRon)
    4.5Ohm
  • On-State Resistance (Max)
    90Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    ADG222
The XCZU48DR-2FSVE1156E is a specific model of integrated circuit (IC) chip manufactured by Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some key points:Advantages: 1. High-performance processing: The XCZU48DR-2FSVE1156E chip combines a powerful Arm Cortex-A53 quad-core processor with programmable logic, enabling high-performance processing capabilities. 2. Programmable logic fabric: The chip includes programmable logic resources, allowing users to implement custom hardware accelerators, interfaces, and other specialized functions. 3. Versatility: The XCZU48DR-2FSVE1156E chip supports a wide range of applications due to its combination of processing power, programmable logic, and various I/O interfaces. 4. Energy efficiency: The chip is designed to optimize power consumption, making it suitable for applications where energy efficiency is crucial. 5. Scalability: The XCZU48DR-2FSVE1156E chip is part of the Zynq UltraScale+ MPSoC family, which offers different models with varying capabilities. This allows for scalability and flexibility in choosing the right chip for specific application requirements.Application Scenarios: 1. Embedded systems: The XCZU48DR-2FSVE1156E chip is commonly used in embedded systems that require both high-performance processing and customizable hardware acceleration. It can be utilized in applications such as industrial automation, robotics, and automotive systems. 2. Edge computing: With its combination of processing power and programmable logic, the chip is suitable for edge computing applications. It can handle real-time data processing, machine learning, and AI inference tasks at the edge of the network. 3. Communications and networking: The XCZU48DR-2FSVE1156E chip's I/O interfaces and processing capabilities make it well-suited for applications in the communications and networking domain. It can be used in routers, switches, base stations, and other network equipment. 4. Video and image processing: The chip's high-performance processing and programmable logic fabric make it ideal for video and image processing applications. It can handle tasks such as video encoding/decoding, image recognition, and computer vision. 5. Aerospace and defense: The XCZU48DR-2FSVE1156E chip's combination of processing power, programmable logic, and energy efficiency makes it suitable for aerospace and defense applications. It can be used in radar systems, avionics, and military-grade equipment.These are just a few examples of the advantages and application scenarios of the XCZU48DR-2FSVE1156E chip. The specific usage will depend on the requirements and needs of the target application.
ADG222BQ Relevant information