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HI1-5040-5

HI1-5040-5

Manufacturer No:

HI1-5040-5

Manufacturer:

Harris Corporation

Description:

IC SWITCH SPSTX1 75OHM 16CERDIP

Datasheet:

Datasheet

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HI1-5040-5 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-CERDIP
  • Package / Case
    16-CDIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 75°C
  • Crosstalk
    -88dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    2nA
  • Channel Capacitance (CS(off), CD(off))
    11pF, 11pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    500ns, 500ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    15V
  • Channel-to-Channel Matching (ΔRon)
    2Ohm
  • On-State Resistance (Max)
    75Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The XCZU11EG-1FFVC1760E is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. High-performance processing: The XCZU11EG-1FFVC1760E chip combines a quad-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor, along with programmable logic resources. This allows for high-performance processing capabilities, making it suitable for demanding applications.2. Programmable logic: The chip includes programmable logic resources, which can be customized and programmed to implement specific functions or algorithms. This flexibility makes it suitable for a wide range of applications that require hardware acceleration or custom logic implementation.3. Integrated peripherals: The XCZU11EG-1FFVC1760E chip includes a wide range of integrated peripherals such as USB, Ethernet, PCIe, and DDR memory controllers. This simplifies the design process and reduces the need for additional external components.4. Low power consumption: The chip is designed to optimize power consumption, making it suitable for applications where power efficiency is important.Application scenarios: 1. Embedded systems: The XCZU11EG-1FFVC1760E chip is commonly used in embedded systems that require high-performance processing capabilities along with programmable logic. It can be used in applications such as industrial automation, robotics, and automotive systems.2. Edge computing: With its combination of processing power and programmable logic, the chip is well-suited for edge computing applications. It can perform real-time processing and analysis of data at the edge of the network, reducing the need for data transmission to the cloud.3. High-performance computing: The XCZU11EG-1FFVC1760E chip can be used in high-performance computing applications that require parallel processing capabilities. It can accelerate computationally intensive tasks and improve overall system performance.4. Video and image processing: The chip's programmable logic resources can be utilized for video and image processing tasks, such as real-time video analytics, object detection, and image recognition.5. Wireless communication: The integrated peripherals of the chip, along with its processing capabilities, make it suitable for wireless communication applications. It can be used in wireless base stations, software-defined radios, and other wireless communication systems.Overall, the XCZU11EG-1FFVC1760E chip offers a combination of processing power, programmable logic, and integrated peripherals, making it suitable for a wide range of applications that require high-performance processing and customization capabilities.
HI1-5040-5 Relevant information