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ISL84762IR Specifications
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TypeParameter
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Supplier Device Package10-TDFN (3x3)
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Package / Case10-VFDFN Exposed Pad
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Crosstalk-95dB @ 100kHz
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Current - Leakage (IS(off)) (Max)2nA
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Channel Capacitance (CS(off), CD(off))115pF
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Charge Injection95pC
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-3db Bandwidth-
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Switch Time (Ton, Toff) (Max)20ns, 12ns
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Voltage - Supply, Dual (V±)-
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Voltage - Supply, Single (V+)1.65V ~ 3.6V
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Channel-to-Channel Matching (ΔRon)50mOhm
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On-State Resistance (Max)600mOhm
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Number of Circuits2
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Multiplexer/Demultiplexer Circuit2:1
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Switch CircuitSPDT
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PackagingTube
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Product StatusObsolete
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Series-
The XCZU43DR-2FSVG1517I is a specific variant of the Xilinx Zynq UltraScale+ MPSoC family, which is designed for high-performance embedded processing applications. Here are some advantages and application scenarios of the XCZU43DR-2FSVG1517I IC chips:Advantages: 1. Versatility: The XCZU43DR-2FSVG1517I integrates both a processing system (Quad-core ARM Cortex-A53) and programmable logic (FPGA) on a single chip. This offers flexibility in implementing a wide range of applications with a mixture of hardware and software processing capabilities.2. High performance: The UltraScale+ architecture provides enhanced performance compared to previous generations. With a rich set of on-chip resources, it offers faster processing, improved memory bandwidth, and accelerated hardware-accelerated algorithms.3. Power efficiency: The UltraScale+ MPSoC devices are designed to optimize power consumption. The heterogeneous architecture allows users to dedicate specific tasks to power-efficient processors, optimizing energy consumption in different parts of the circuit.4. Programmability: The FPGA fabric allows users to implement custom hardware accelerators and I/O interfaces, providing flexibility to adapt the design as per the specific requirements of the application.5. Connectivity: The XCZU43DR-2FSVG1517I supports a wide range of communication protocols and interfaces, including PCIe, Ethernet, USB 3.0, DDR4 memory interfaces, and high-speed serial transceivers. This enables seamless integration with various peripherals and external devices.Application Scenarios: 1. Embedded Vision Systems: The XCZU43DR-2FSVG1517I can be applied in developing high-performance vision systems, such as surveillance cameras, robotics, drones, or automated inspection systems. The combination of ARM processors and programmable logic enables real-time video processing, image recognition, and various computer vision algorithms.2. Aerospace and Defense: The XCZU43DR-2FSVG1517I is suitable for applications in the aerospace and defense sectors. It can be used in radar and sonar systems, software-defined radios (SDRs), electronic warfare systems, or UAVs (unmanned aerial vehicles), where high-performance signal processing and mission-specific hardware acceleration are required.3. High-Performance Networking: The FPGA fabric of the XCZU43DR-2FSVG1517I can be used to implement custom networking protocols, network processing offloads, or packet processing accelerators. This makes it suitable for applications like switches, routers, and network security appliances where high-speed, low-latency networking capabilities are essential.4. Industrial Automation: The XCZU43DR-2FSVG1517I can be utilized in industrial automation systems, including robotics, machine vision, and motion control. The combination of real-time processing capabilities, integrated connectivity options, and programmable logic makes it suitable for controlling and monitoring complex industrial processes.5. High-Performance Computing: With its powerful processing capabilities, the XCZU43DR-2FSVG1517I can be deployed in HPC (High-Performance Computing) applications, data centers, or cloud-based services to accelerate computationally intensive workloads, cryptography, or scientific simulations.It's important to note that the specific application scenarios may vary, and these are just some common examples where the XCZU43DR-2FSVG1517I IC chips can be advantageous.
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