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ISL83699IV

ISL83699IV

Manufacturer No:

ISL83699IV

Manufacturer:

Intersil

Description:

IC SWITCH SPDTX4 450MOHM 16TSSOP

Datasheet:

Datasheet

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ISL83699IV Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -98dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    3nA
  • Channel Capacitance (CS(off), CD(off))
    106pF
  • Charge Injection
    -82pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    17ns, 14ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.65V ~ 3.6V
  • Channel-to-Channel Matching (ΔRon)
    40mOhm
  • On-State Resistance (Max)
    450mOhm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    SPDT
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XCZU3EG-1UBVA530E is a specific model of integrated circuit chip from Xilinx. It belongs to the Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some of them:Advantages: 1. High-performance processing: The XCZU3EG-1UBVA530E chip combines a processing system (PS) with programmable logic (PL), enabling high-performance processing capabilities. 2. Versatility: It provides a wide range of programmable logic resources, including configurable logic blocks (CLBs), digital signal processing (DSP) slices, and memory blocks, allowing for flexible implementation of various applications. 3. System integration: The chip integrates multiple processing cores, such as ARM Cortex-A53 application processors and ARM Cortex-R5 real-time processors, along with other peripherals, reducing the need for external components and simplifying system design. 4. Power efficiency: The XCZU3EG-1UBVA530E chip incorporates power management features, enabling efficient power usage and reducing overall energy consumption. 5. Scalability: It offers scalability options, allowing for the addition of custom IP cores and expansion of functionality as per application requirements.Application Scenarios: 1. Embedded Systems: The XCZU3EG-1UBVA530E chip is suitable for embedded systems that require high-performance processing, such as industrial automation, robotics, and automotive applications. 2. Edge Computing: With its processing capabilities and system integration, it can be used in edge computing devices that require real-time processing and low latency, such as edge AI inference systems or edge servers. 3. Video and Image Processing: The chip's programmable logic resources make it suitable for video and image processing applications, including video surveillance, medical imaging, and multimedia systems. 4. Wireless Communication: It can be utilized in wireless communication systems, such as base stations or software-defined radios, where high-performance processing and system integration are crucial. 5. High-Performance Computing: The XCZU3EG-1UBVA530E chip's capabilities make it suitable for high-performance computing applications, including scientific research, data centers, and cloud computing.These advantages and application scenarios highlight the versatility and performance of the XCZU3EG-1UBVA530E chip, making it suitable for a wide range of applications that require high-performance processing and system integration.
ISL83699IV Relevant information