ISL43L680IR

ISL43L680IR

Manufacturer No:

ISL43L680IR

Manufacturer:

Intersil

Description:

IC MUX 8:1 750MOHM 16TQFN

Datasheet:

Datasheet

Delivery:

Payment:

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ISL43L680IR Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TQFN (3x3)
  • Package / Case
    16-WFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    4nA
  • Channel Capacitance (CS(off), CD(off))
    65pF, 470pF
  • Charge Injection
    -20pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    33ns, 25ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.6V ~ 3.6V
  • Channel-to-Channel Matching (ΔRon)
    120mOhm
  • On-State Resistance (Max)
    750mOhm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XCZU3EG-1UBVA530I is a specific model of integrated circuit (IC) chip from Xilinx. It belongs to the Xilinx Zynq UltraScale+ MPSoC family and offers several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The XCZU3EG-1UBVA530I chip provides high-performance processing capabilities with its quad-core ARM Cortex-A53 processor and dual-core ARM Cortex-R5 real-time processor. It also includes programmable logic resources, making it suitable for a wide range of applications. 2. Programmability: The chip is highly programmable, allowing users to customize and optimize its functionality according to their specific requirements. This flexibility makes it suitable for various applications. 3. Integration: The XCZU3EG-1UBVA530I chip integrates multiple components, including processors, programmable logic, memory interfaces, and various peripherals, into a single device. This integration reduces the need for external components, simplifies the design, and saves board space. 4. Power Efficiency: The chip is designed to be power-efficient, enabling longer battery life in portable devices and reducing power consumption in other applications. 5. High-Speed Interfaces: It supports various high-speed interfaces like PCIe, USB, Ethernet, and DDR4 memory interfaces, enabling connectivity with external devices and high-speed data transfer.Application Scenarios: 1. Embedded Systems: The XCZU3EG-1UBVA530I chip is commonly used in embedded systems, where it combines processing power, programmable logic, and various peripherals to implement complex functionalities. It can be used in applications like industrial automation, robotics, automotive systems, and aerospace. 2. Edge Computing: With its high-performance processing capabilities, the chip is suitable for edge computing applications. It can perform real-time data processing and analysis at the edge of the network, reducing latency and enabling faster decision-making. 3. High-Performance Computing: The XCZU3EG-1UBVA530I chip can be used in high-performance computing applications that require significant processing power and parallel computing capabilities. It can accelerate computationally intensive tasks and improve overall system performance. 4. Networking and Communication: The chip's support for high-speed interfaces makes it suitable for networking and communication applications. It can be used in routers, switches, network appliances, and other devices that require high-speed data transfer and connectivity. 5. Video and Image Processing: The XCZU3EG-1UBVA530I chip's processing capabilities and programmable logic resources make it suitable for video and image processing applications. It can be used in video surveillance systems, medical imaging devices, and other applications that require real-time processing of visual data.These are just a few examples of the advantages and application scenarios of the XCZU3EG-1UBVA530I chip. Its versatility and flexibility make it suitable for a wide range of applications across various industries.