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MAX4634ETB

MAX4634ETB

Manufacturer No:

MAX4634ETB

Description:

IC SWITCH SP4T X 1 4OHM 10TDFN

Datasheet:

Datasheet

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MAX4634ETB Specifications

  • Type
    Parameter
  • Supplier Device Package
    10-TDFN-EP (3x3)
  • Package / Case
    10-WFDFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -52dB @ 10MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    13pF
  • Charge Injection
    2pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    18ns, 11ns
  • Voltage - Supply, Dual (V±)
    -
  • Voltage - Supply, Single (V+)
    1.8V ~ 5.5V
  • Channel-to-Channel Matching (ΔRon)
    100mOhm
  • On-State Resistance (Max)
    4Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The M2S150-1FCS536 is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S150-1FCS536 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S150-1FCS536 chip suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling the chip to handle complex tasks and applications.Application scenarios: 1. Industrial automation: The M2S150-1FCS536 chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its low power consumption and integration of FPGA and microcontroller, the chip can be used in IoT devices for edge computing, data processing, and connectivity. 3. Aerospace and defense: The security features of the SmartFusion2 family make the M2S150-1FCS536 chip suitable for aerospace and defense applications that require secure boot, data protection, and tamper detection. 4. Medical devices: The chip's versatility and integration make it suitable for medical devices such as patient monitoring systems, medical imaging equipment, and diagnostic devices. 5. Communications: The M2S150-1FCS536 chip can be used in communication systems for tasks such as protocol conversion, signal processing, and encryption/decryption.These are just a few examples of the advantages and application scenarios of the M2S150-1FCS536 chip. The versatility and integration of this chip make it suitable for a wide range of applications where both hardware customization and software programmability are required.
MAX4634ETB Relevant information