MAX336CWI+T

MAX336CWI+T

Manufacturer No:

MAX336CWI+T

Description:

IC MUX 16:1 400OHM 28SOIC

Datasheet:

Datasheet

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MAX336CWI+T Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-SOIC
  • Package / Case
    28-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C (TA)
  • Crosstalk
    -86dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    20pA
  • Channel Capacitance (CS(off), CD(off))
    2pF, 20pF
  • Charge Injection
    3.5pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    500ns, 500ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    4.5V ~ 20V
  • Channel-to-Channel Matching (ΔRon)
    5Ohm
  • On-State Resistance (Max)
    400Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    16:1
  • Switch Circuit
    -
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S025-FGG484I is an integrated circuit chip from Microsemi, which belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S025-FGG484I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. This makes the M2S025-FGG484I chip suitable for applications that require secure and reliable operation. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling the chip to handle complex tasks and applications.Application scenarios: 1. Industrial automation: The M2S025-FGG484I chip can be used in industrial automation systems for tasks such as control, monitoring, and communication. Its FPGA fabric allows for customization of interfaces and protocols, while the microcontroller subsystem can handle real-time control and communication tasks. 2. Internet of Things (IoT): The chip's combination of FPGA and microcontroller makes it suitable for IoT applications. It can be used for sensor interfacing, data processing, and communication in IoT devices. 3. Automotive: The M2S025-FGG484I chip can be used in automotive applications such as advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs). Its security features and high-performance processing capabilities are beneficial in these applications. 4. Aerospace and defense: The chip's reliability, security features, and low power consumption make it suitable for aerospace and defense applications. It can be used in avionics systems, communication systems, and secure data processing. 5. Medical devices: The M2S025-FGG484I chip can be used in medical devices such as patient monitoring systems, diagnostic equipment, and medical imaging devices. Its customization capabilities, low power consumption, and high performance are advantageous in these applications.These are just a few examples of the advantages and application scenarios of the M2S025-FGG484I chip. The versatility and integration of this chip make it suitable for a wide range of applications where both hardware customization and software programmability are required.