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ADGS1208BCPZ-RL7

ADGS1208BCPZ-RL7

Manufacturer No:

ADGS1208BCPZ-RL7

Manufacturer:

Analog Devices Inc.

Description:

IC MUX 8:1 200OHM 24LFCSP

Datasheet:

Datasheet

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Payment:

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ADGS1208BCPZ-RL7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-LFCSP (4x4)
  • Package / Case
    24-WFQFN Exposed Pad, CSP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    100pA
  • Channel Capacitance (CS(off), CD(off))
    1pF, 5pF
  • Charge Injection
    0.4pC
  • -3db Bandwidth
    550MHz
  • Switch Time (Ton, Toff) (Max)
    110ns, 135ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    12V
  • Channel-to-Channel Matching (ΔRon)
    3.5Ohm
  • On-State Resistance (Max)
    200Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The 5CSEBA6U23C6N is an integrated circuit chip from the Intel Cyclone V series. It is a field-programmable gate array (FPGA) chip that offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the 5CSEBA6U23C6N chip are:Advantages: 1. High Performance: The 5CSEBA6U23C6N chip provides high-performance capabilities, making it suitable for demanding applications that require fast processing speeds and low latency.2. Flexibility: Being an FPGA chip, it offers flexibility in terms of reconfigurability. Users can program and reprogram the chip to perform different functions, allowing for customization and adaptability to changing requirements.3. Low Power Consumption: The 5CSEBA6U23C6N chip is designed to be power-efficient, making it suitable for applications where power consumption is a concern. It helps in reducing overall energy costs and extending battery life in portable devices.4. Integration: The chip integrates various components and features, including programmable logic elements, memory blocks, digital signal processing (DSP) blocks, and high-speed transceivers. This integration simplifies the design process and reduces the need for external components.Application Scenarios: 1. Communications: The 5CSEBA6U23C6N chip can be used in communication systems, such as wireless base stations, routers, and network switches. Its high-performance capabilities and integrated transceivers make it suitable for handling data-intensive tasks and high-speed communication protocols.2. Industrial Automation: The chip can be utilized in industrial automation applications, including robotics, machine vision, and control systems. Its flexibility allows for the implementation of complex algorithms and real-time control, enabling precise and efficient automation processes.3. Aerospace and Defense: The 5CSEBA6U23C6N chip finds applications in aerospace and defense systems, such as radar systems, avionics, and secure communication systems. Its high-performance processing capabilities and integration of security features make it suitable for demanding and secure applications.4. Internet of Things (IoT): With its low power consumption and flexibility, the chip can be used in IoT devices and edge computing applications. It enables the implementation of custom logic and processing algorithms in small form-factor devices, contributing to the growth of the IoT ecosystem.5. Medical Devices: The 5CSEBA6U23C6N chip can be employed in medical devices, such as imaging systems, patient monitoring devices, and diagnostic equipment. Its high-performance processing capabilities and integration of signal processing blocks enable efficient data processing and analysis in medical applications.These are just a few examples of the advantages and application scenarios of the 5CSEBA6U23C6N integrated circuit chip. Its versatility and performance make it suitable for a wide range of applications across various industries.
ADGS1208BCPZ-RL7 Relevant information