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MAX313LETP+T

MAX313LETP+T

Manufacturer No:

MAX313LETP+T

Description:

IC SWITCH SPST-NOX4 10OHM 20TQFN

Datasheet:

Datasheet

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MAX313LETP+T Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TQFN (5x5)
  • Package / Case
    20-WQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    15pF, 15pF
  • Charge Injection
    20pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    225ns, 185ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    4.5V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    300mOhm
  • On-State Resistance (Max)
    10Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XCZU2CG-1SFVC784E is a specific integrated circuit chip belonging to the Xilinx Zynq UltraScale+ family. The advantages and application scenarios of this chip are as follows:Advantages: 1. Versatility: The XCZU2CG-1SFVC784E chip combines the capabilities of a high-performance application processor (ARM Cortex-A53) with an FPGA (Field-Programmable Gate Array). This versatility allows for a wide range of applications and the ability to implement custom hardware accelerators. 2. High-performance processing: With the ARM Cortex-A53 application processor, the chip offers high-performance processing capabilities for various tasks such as running operating systems, applications, and real-time software. 3. Programmable logic: The FPGA on the chip provides programmable logic that can be dynamically reconfigured to implement custom hardware designs. This flexibility is ideal for applications requiring real-time processing, hardware acceleration, or the ability to interface with specialized protocols or peripherals. 4. Low-latency processing: The combination of programmable logic and processor allows for low-latency processing by offloading computationally intensive tasks to the FPGA fabric, reducing the overall system response time.Application Scenarios: 1. Embedded systems: The XCZU2CG-1SFVC784E chip is well-suited for embedded systems applications where both hardware acceleration and high-performance processing are required. It can be used in applications such as robotics, industrial automation, medical devices, or aerospace systems. 2. Image and signal processing: The flexibility of the FPGA fabric enables the implementation of custom image and signal processing algorithms, making the chip suitable for applications like video processing, image recognition, or software-defined radio. 3. Edge computing: With a combination of high-performance processing and hardware acceleration, the chip can handle complex data processing tasks at the edge of a network. This makes it ideal for scenarios like edge AI, IoT gateways, or real-time analytics. 4. Prototyping and development: The XCZU2CG-1SFVC784E chip can be used as a platform for prototyping and development of custom hardware designs. Its programmable logic allows for iterative design cycles and rapid implementation of proof-of-concepts.These advantages and application scenarios highlight the capabilities and potential uses of the XCZU2CG-1SFVC784E integrated circuit chips. However, the specific choice of this chip for a given application should consider factors such as performance requirements, power consumption, and system integration considerations.
MAX313LETP+T Relevant information