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MAX312LEUE+T

MAX312LEUE+T

Manufacturer No:

MAX312LEUE+T

Description:

IC SW SPST-NCX4 10OHM 16TSSOP

Datasheet:

Datasheet

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MAX312LEUE+T Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -85dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    15pF, 15pF
  • Charge Injection
    20pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    225ns, 185ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    4.5V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    300mOhm
  • On-State Resistance (Max)
    10Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NC
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S090TS-FGG676 is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090TS-FGG676 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 processor core. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components such as FPGA fabric, processor, memory, and peripherals on a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S090TS-FGG676, offers advanced security features like secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require high levels of security. 4. Low power consumption: The chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 5. High performance: The FPGA fabric combined with the ARM Cortex-M3 processor core provides high-performance computing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S090TS-FGG676 chip can be used in industrial automation applications such as motor control, robotics, and machine vision. Its FPGA fabric allows for real-time control and customization, while the processor core handles high-level control and communication tasks. 2. Aerospace and defense: The chip's security features make it suitable for aerospace and defense applications that require secure communication, data encryption, and protection against tampering. 3. Internet of Things (IoT): The chip's low power consumption and integration capabilities make it suitable for IoT applications such as smart home devices, wearable technology, and sensor networks. 4. Medical devices: The M2S090TS-FGG676 chip can be used in medical devices like patient monitoring systems, medical imaging equipment, and diagnostic devices. Its combination of FPGA and processor allows for real-time signal processing and customization. 5. Communications: The chip can be used in communication systems such as routers, switches, and network appliances. Its FPGA fabric can be used for protocol handling, while the processor core handles higher-level networking tasks.These are just a few examples of the advantages and application scenarios of the M2S090TS-FGG676 chip. The versatility and integration of this chip make it suitable for a wide range of applications where both hardware customization and software programmability are required.
MAX312LEUE+T Relevant information