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ADG5248FBCPZ-RL7

ADG5248FBCPZ-RL7

Manufacturer No:

ADG5248FBCPZ-RL7

Manufacturer:

Analog Devices Inc.

Description:

IC MUX 8:1 335OHM 20LFCSP

Datasheet:

Datasheet

Delivery:

Payment:

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ADG5248FBCPZ-RL7 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-LFCSP (4x4)
  • Package / Case
    20-WFQFN Exposed Pad, CSP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -75dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    1nA
  • Channel Capacitance (CS(off), CD(off))
    4pF, 13pF
  • Charge Injection
    -1.2pC
  • -3db Bandwidth
    200MHz
  • Switch Time (Ton, Toff) (Max)
    245ns, 135ns
  • Voltage - Supply, Dual (V±)
    ±5V ~ 22V
  • Voltage - Supply, Single (V+)
    8V ~ 44V
  • Channel-to-Channel Matching (ΔRon)
    3Ohm
  • On-State Resistance (Max)
    335Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The XCZU1CG-1SFVA625E is a specific model of the Xilinx Zynq UltraScale+ MPSoC family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The XCZU1CG-1SFVA625E combines a high-performance processing system (Quad-core ARM Cortex-A53) with programmable logic (FPGA) in a single chip. This allows for a wide range of applications and flexibility in system design. 2. High-performance processing: The ARM Cortex-A53 cores provide powerful processing capabilities, making it suitable for applications that require intensive computation or running complex software. 3. Programmable logic: The FPGA fabric in the chip allows for hardware customization and acceleration, enabling the implementation of custom logic and algorithms tailored to specific application requirements. 4. Integrated peripherals: The chip includes various peripherals such as USB, Ethernet, PCIe, and memory controllers, reducing the need for additional external components and simplifying system design.Application scenarios: 1. Embedded systems: The XCZU1CG-1SFVA625E is commonly used in embedded systems where both high-performance processing and hardware customization are required. It can be used in applications such as industrial automation, robotics, and automotive systems. 2. Software-defined radio (SDR): The FPGA fabric in the chip can be utilized to implement signal processing algorithms for SDR applications, allowing for flexible and reconfigurable radio systems. 3. High-performance computing (HPC): The powerful processing capabilities of the ARM cores combined with FPGA acceleration make the XCZU1CG-1SFVA625E suitable for HPC applications, including data analytics, image processing, and scientific simulations. 4. Edge computing: The chip's combination of processing power and programmable logic makes it suitable for edge computing applications, where real-time processing and low latency are required. It can be used in edge AI, video analytics, and IoT gateways.These are just a few examples, and the XCZU1CG-1SFVA625E can be applied in various other domains where a combination of high-performance processing and hardware customization is needed.
ADG5248FBCPZ-RL7 Relevant information