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HI9P0549-9 Specifications
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TypeParameter
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Supplier Device Package16-SOIC
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Package / Case16-SOIC (0.154", 3.90mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Crosstalk-
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Current - Leakage (IS(off)) (Max)30pA (Typ)
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Channel Capacitance (CS(off), CD(off))10pF, 12pF
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Charge Injection-
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-3db Bandwidth-
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Switch Time (Ton, Toff) (Max)300ns, 300ns (Typ)
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Voltage - Supply, Dual (V±)±15V
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Voltage - Supply, Single (V+)-
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Channel-to-Channel Matching (ΔRon)126Ohm
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On-State Resistance (Max)1.8kOhm
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Number of Circuits2
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Multiplexer/Demultiplexer Circuit4:1
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Switch CircuitSP4T
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PackagingBag
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Product StatusObsolete
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Series-
The UPD60802F1-A11-BND-E2-A integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: These chips offer high-speed processing capabilities, making them suitable for applications that require quick data processing. 2. Low Power Consumption: The chips are designed to consume minimal power, making them energy-efficient and suitable for battery-powered devices. 3. Compact Size: The chips are compact in size, allowing for easy integration into various electronic devices. 4. Versatility: These chips can be used in a wide range of applications, thanks to their flexible design and compatibility with different systems. 5. Reliability: The chips are known for their reliability and stability, ensuring consistent performance over extended periods.Application Scenarios: 1. Consumer Electronics: The chips can be used in various consumer electronic devices such as smartphones, tablets, gaming consoles, and digital cameras, where high performance and low power consumption are crucial. 2. Automotive: These chips can be utilized in automotive applications like infotainment systems, advanced driver-assistance systems (ADAS), and engine control units (ECUs) to enable efficient data processing and reliable performance. 3. Industrial Automation: The chips can be employed in industrial automation systems for tasks like data acquisition, control, and monitoring, where high-speed processing and reliability are essential. 4. Internet of Things (IoT): These chips can be integrated into IoT devices such as smart home appliances, wearables, and connected sensors, enabling efficient data processing and communication. 5. Communication Systems: The chips can be used in networking equipment, routers, and switches to handle high-speed data processing and ensure reliable communication.Overall, the UPD60802F1-A11-BND-E2-A integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for a wide range of applications in various industries.
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