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HI9P0506-9

HI9P0506-9

Manufacturer No:

HI9P0506-9

Manufacturer:

Harris Corporation

Description:

IC MUX 16:1 400OHM 28SOIC

Datasheet:

Datasheet

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HI9P0506-9 Specifications

  • Type
    Parameter
  • Supplier Device Package
    28-SOIC
  • Package / Case
    28-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    30pA (Typ)
  • Channel Capacitance (CS(off), CD(off))
    10pF, 52pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    250ns, 250ns (Typ)
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    20Ohm
  • On-State Resistance (Max)
    400Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    16:1
  • Switch Circuit
    -
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The 5CSXFC6C6U23I7N is an integrated circuit chip from Intel's Cyclone V series of Field-Programmable Gate Arrays (FPGAs). Here are some advantages and application scenarios of this chip:Advantages: 1. High Performance: The 5CSXFC6C6U23I7N chip offers high-speed processing capabilities, making it suitable for applications that require real-time data processing and high-performance computing. 2. Flexibility: Being an FPGA, it allows for reprogramming and customization of the chip's functionality even after deployment. This flexibility makes it suitable for applications that require frequent updates or changes in functionality. 3. Low Power Consumption: The chip is designed to be power-efficient, making it suitable for battery-powered or energy-constrained applications. 4. Integration: The 5CSXFC6C6U23I7N chip integrates various components like logic elements, memory blocks, and digital signal processing (DSP) blocks, reducing the need for external components and simplifying the overall system design.Application Scenarios: 1. Embedded Systems: The chip can be used in various embedded systems applications, such as industrial automation, robotics, and automotive electronics. Its high performance and flexibility make it suitable for controlling and processing data in real-time. 2. Communications: The 5CSXFC6C6U23I7N chip can be used in communication systems, including wireless base stations, routers, and network switches. Its high-speed processing capabilities and integration of DSP blocks make it suitable for handling data-intensive communication protocols. 3. Video and Image Processing: The chip's high-performance computing capabilities and integration of DSP blocks make it suitable for video and image processing applications, such as video surveillance, medical imaging, and multimedia systems. 4. Internet of Things (IoT): The chip can be used in IoT applications, where it can handle data processing, sensor interfacing, and communication tasks. Its low power consumption and flexibility make it suitable for IoT devices deployed in various domains like smart homes, agriculture, and industrial monitoring.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design choices made by the system designer.
HI9P0506-9 Relevant information