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HI3-0518-5Z

HI3-0518-5Z

Manufacturer No:

HI3-0518-5Z

Manufacturer:

Intersil

Description:

IC MUX 8:1 750OHM 18DIP

Datasheet:

Datasheet

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Payment:

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HI3-0518-5Z Specifications

  • Type
    Parameter
  • Supplier Device Package
    18-PDIP
  • Package / Case
    18-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 75°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    10pA (Typ)
  • Channel Capacitance (CS(off), CD(off))
    5pF, 10pF (Max)
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    175ns, 175ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    750Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    8:1
  • Switch Circuit
    -
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XCVC1802-2MLIVSVD1760 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The XCVC1802-2MLIVSVD1760 chips offer high-performance capabilities, making them suitable for demanding applications. 2. Low Power Consumption: These chips are designed to consume low power, making them energy-efficient and suitable for battery-powered devices. 3. Versatility: The XCVC1802-2MLIVSVD1760 chips are versatile and can be used in various applications due to their flexible architecture. 4. Advanced Features: These chips come with advanced features such as high-speed interfaces, memory controllers, and DSP capabilities, enabling them to handle complex tasks efficiently. 5. Scalability: The XCVC1802-2MLIVSVD1760 chips are scalable, allowing for easy integration into different systems and future upgrades.Application Scenarios: 1. Embedded Systems: These chips can be used in embedded systems such as industrial automation, robotics, and IoT devices, where high performance and low power consumption are crucial. 2. Communication Systems: The XCVC1802-2MLIVSVD1760 chips can be utilized in communication systems like routers, switches, and network appliances, where fast data processing and low latency are required. 3. Automotive Electronics: These chips can be employed in automotive applications such as advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs), where reliability, performance, and power efficiency are essential. 4. Medical Devices: The XCVC1802-2MLIVSVD1760 chips can be used in medical devices like imaging systems, patient monitoring devices, and diagnostic equipment, where real-time processing and accuracy are critical. 5. Aerospace and Defense: These chips can find applications in aerospace and defense systems, including radar systems, avionics, and military communication equipment, where high-performance computing and ruggedness are required.Overall, the XCVC1802-2MLIVSVD1760 integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for a wide range of applications in various industries.
HI3-0518-5Z Relevant information