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HI9P5051-9 Specifications
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TypeParameter
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Supplier Device Package16-SOIC
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Package / Case16-SOIC (0.154", 3.90mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Crosstalk-88dB @ 100kHz
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Current - Leakage (IS(off)) (Max)2nA
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Channel Capacitance (CS(off), CD(off))11pF, 11pF
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Charge Injection-
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-3db Bandwidth-
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Switch Time (Ton, Toff) (Max)500ns, 500ns
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Voltage - Supply, Dual (V±)±15V
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Voltage - Supply, Single (V+)-
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Channel-to-Channel Matching (ΔRon)1Ohm
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On-State Resistance (Max)45Ohm
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Number of Circuits2
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Multiplexer/Demultiplexer Circuit2:1
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Switch CircuitSPDT
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PackagingBag
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Product StatusObsolete
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Series-
The M2S090TS-1FGG676 is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090TS-1FGG676 chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S090TS-1FGG676, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S090TS-1FGG676 chip can be used in industrial automation applications such as motor control, robotics, and process control. Its FPGA fabric allows for custom hardware interfaces and real-time control, while the microcontroller subsystem can handle communication protocols and higher-level control tasks. 2. Internet of Things (IoT): With its low power consumption and integrated security features, the chip is suitable for IoT applications such as smart home devices, sensor networks, and wearable devices. The FPGA fabric can be used for sensor interfacing and data processing, while the microcontroller subsystem can handle connectivity and application logic. 3. Aerospace and defense: The chip's security features, high performance, and integration make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, and military-grade embedded systems. 4. Medical devices: The chip's versatility and low power consumption make it suitable for medical device applications such as patient monitoring, diagnostic equipment, and portable medical devices. The FPGA fabric can be used for signal processing and customization, while the microcontroller subsystem can handle data acquisition and communication. 5. Automotive: The chip can be used in automotive applications such as advanced driver-assistance systems (ADAS), infotainment systems, and vehicle control units. Its high performance and integration enable real-time processing, connectivity, and customization.These are just a few examples of the advantages and application scenarios of the M2S090TS-1FGG676 chip. The versatility and features of this chip make it suitable for a wide range of applications where a combination of FPGA and microcontroller capabilities is required.
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