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HI1-0509-4

HI1-0509-4

Manufacturer No:

HI1-0509-4

Manufacturer:

Intersil

Description:

IC SWITCH SP4TX2 400OHM 16CERDIP

Datasheet:

Datasheet

Delivery:

Payment:

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HI1-0509-4 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-CERDIP
  • Package / Case
    16-CDIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -25°C ~ 85°C (TA)
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    30pA (Typ)
  • Channel Capacitance (CS(off), CD(off))
    10pF, 30pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    500ns, 500ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    20Ohm
  • On-State Resistance (Max)
    400Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    4:1
  • Switch Circuit
    SP4T
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The PEF88602VV3.1 integrated circuit chips have several advantages and application scenarios:1. High Performance: The PEF88602VV3.1 chips offer high-performance capabilities, enabling efficient and reliable data processing.2. Versatility: These chips are versatile and can be used in various applications, including telecommunications, networking, and industrial automation.3. Power Efficiency: The PEF88602VV3.1 chips are designed to be power-efficient, helping to reduce energy consumption and extend battery life in portable devices.4. Advanced Features: These chips come with advanced features such as integrated Ethernet MAC, PHY, and DSP, enabling seamless connectivity and enhanced signal processing capabilities.5. Broadband Applications: The PEF88602VV3.1 chips are suitable for broadband applications, including DSL (Digital Subscriber Line) and VDSL (Very High Bitrate Digital Subscriber Line) systems.6. Telecommunication Infrastructure: These chips can be used in telecommunication infrastructure equipment, such as DSLAMs (Digital Subscriber Line Access Multiplexer) and MSANs (Multi-Service Access Nodes), to enable high-speed data transmission.7. Network Switching: The PEF88602VV3.1 chips can be utilized in network switching equipment, providing efficient data routing and switching capabilities.8. Industrial Automation: These chips find applications in industrial automation systems, enabling reliable and high-speed communication between various devices and control systems.9. Internet of Things (IoT): The PEF88602VV3.1 chips can be integrated into IoT devices, facilitating seamless connectivity and data processing in smart homes, smart cities, and other IoT applications.Overall, the PEF88602VV3.1 integrated circuit chips offer high performance, power efficiency, and versatility, making them suitable for a wide range of applications in telecommunications, networking, industrial automation, and IoT.
HI1-0509-4 Relevant information