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HI1-5049-5

HI1-5049-5

Manufacturer No:

HI1-5049-5

Manufacturer:

Intersil

Description:

IC SW DPST-NOX2 45OHM 16CERDIP

Datasheet:

Datasheet

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Payment:

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HI1-5049-5 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-CERDIP
  • Package / Case
    16-CDIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 75°C (TA)
  • Crosstalk
    -88dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    2nA
  • Channel Capacitance (CS(off), CD(off))
    11pF, 11pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    500ns, 500ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    -
  • Channel-to-Channel Matching (ΔRon)
    2Ohm
  • On-State Resistance (Max)
    45Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    2:1
  • Switch Circuit
    DPST - NO
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The M2S090TS-FCSG325I is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090TS-FCSG325I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S090TS-FCSG325I, offers advanced security features such as secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require high levels of security. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Industrial automation: The M2S090TS-FCSG325I chip can be used in industrial automation applications such as programmable logic controllers (PLCs), motor control systems, and industrial networking. Its FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller subsystem, the chip can be used in IoT applications that require both hardware flexibility and software programmability. It can be used for sensor data processing, edge computing, and connectivity. 3. Aerospace and defense: The chip's security features make it suitable for aerospace and defense applications that require protection against tampering and secure boot capabilities. It can be used in avionics systems, military communication systems, and secure data processing. 4. Medical devices: The chip's low power consumption and integration capabilities make it suitable for medical devices such as patient monitoring systems, portable medical equipment, and medical imaging devices. 5. Communications: The chip can be used in communication systems such as network switches, routers, and wireless base stations. Its FPGA fabric allows for customization and adaptation to specific communication protocols and standards.These are just a few examples of the advantages and application scenarios of the M2S090TS-FCSG325I chip. The versatility and integration of this chip make it suitable for a wide range of applications across various industries.
HI1-5049-5 Relevant information