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MAX313FESE+T

MAX313FESE+T

Manufacturer No:

MAX313FESE+T

Description:

IC SWITCH SPST-NOX4 10OHM 16SOIC

Datasheet:

Datasheet

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MAX313FESE+T Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C (TA)
  • Crosstalk
    -104dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    1µA
  • Channel Capacitance (CS(off), CD(off))
    20pF, 20pF
  • Charge Injection
    70pC
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    225ns, 185ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 20V
  • Voltage - Supply, Single (V+)
    9V ~ 36V
  • Channel-to-Channel Matching (ΔRon)
    50mOhm
  • On-State Resistance (Max)
    10Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The BCM53575B0IFSBG is a specific model of integrated circuit chip developed by Broadcom. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The BCM53575B0IFSBG chip is designed to deliver high performance and throughput, making it suitable for demanding networking applications. 2. Integration: It integrates multiple functions and features into a single chip, reducing the need for additional components and simplifying the overall design. 3. Power Efficiency: The chip is designed to be power-efficient, helping to reduce energy consumption and extend battery life in portable devices. 4. Scalability: The chip offers scalability options, allowing it to be used in a wide range of applications, from small-scale deployments to large-scale enterprise networks. 5. Security Features: It includes built-in security features to help protect against various threats and ensure data integrity.Application Scenarios: 1. Wireless Access Points: The BCM53575B0IFSBG chip can be used in wireless access points to provide high-speed Wi-Fi connectivity and manage network traffic efficiently. 2. Home Routers: It can be used in home routers to enable high-performance internet connectivity, allowing multiple devices to connect to the internet simultaneously. 3. Small and Medium-sized Business Networks: The chip can be utilized in small and medium-sized business networks to provide reliable and secure networking solutions. 4. Internet of Things (IoT) Devices: It can be integrated into IoT devices to enable wireless connectivity and communication between devices, facilitating IoT deployments. 5. Campus Networks: The chip can be used in campus networks to provide high-speed connectivity and manage network traffic in educational institutions or corporate campuses.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and capabilities of the chip, and it is always recommended to refer to the manufacturer's documentation and specifications for accurate information.
MAX313FESE+T Relevant information