DG406CWI+T
Manufacturer No:
DG406CWI+T
Manufacturer:
Description:
IC MUX 16:1 100OHM 28SOIC
Datasheet:
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In Stock : 0
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DG406CWI+T Specifications
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TypeParameter
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Supplier Device Package28-SOIC
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Package / Case28-SOIC (0.295", 7.50mm Width)
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Mounting TypeSurface Mount
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Operating Temperature0°C ~ 70°C (TA)
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Crosstalk-92dB @ 100kHz
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Current - Leakage (IS(off)) (Max)500pA
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Channel Capacitance (CS(off), CD(off))8pF, 130pF
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Charge Injection2pC
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-3db Bandwidth-
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Switch Time (Ton, Toff) (Max)200ns, 150ns
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Voltage - Supply, Dual (V±)±4.5V ~ 20V
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Voltage - Supply, Single (V+)5V ~ 30V
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Channel-to-Channel Matching (ΔRon)1.5Ohm
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On-State Resistance (Max)100Ohm
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Number of Circuits1
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Multiplexer/Demultiplexer Circuit16:1
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Switch Circuit-
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusActive
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Series-
The PEF88208ELV3.1-G integrated circuit chip is a specific product from Infineon Technologies, and its advantages and application scenarios can be summarized as follows:Advantages: 1. High Integration: The chip integrates multiple functions into a single device, reducing the need for external components and simplifying the overall system design. 2. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered devices or energy-efficient applications. 3. High Performance: The chip offers high-performance capabilities, enabling efficient data processing and communication. 4. Robustness and Reliability: The chip is designed to withstand harsh operating conditions, ensuring reliable operation in various environments. 5. Cost-Effective: The integration of multiple functions and the high-performance capabilities of the chip contribute to cost savings in system design and manufacturing.Application Scenarios: 1. Industrial Automation: The chip can be used in industrial automation systems for data acquisition, control, and communication tasks. It can enable efficient and reliable communication between different components of the system. 2. Internet of Things (IoT): The chip can be utilized in IoT devices for data processing, connectivity, and communication. It can enable efficient data transfer and integration with cloud platforms. 3. Automotive Electronics: The chip can be applied in automotive electronics for various functions such as communication, control, and sensing. It can enable efficient and reliable communication between different automotive systems. 4. Smart Grid: The chip can be used in smart grid applications for data acquisition, control, and communication. It can enable efficient and secure communication between different components of the smart grid system. 5. Telecommunications: The chip can be utilized in telecommunications systems for data processing, signal conditioning, and communication. It can enable efficient and reliable communication between different telecommunications equipment.These are just a few examples of the potential advantages and application scenarios of the PEF88208ELV3.1-G integrated circuit chip. The specific usage will depend on the requirements and design of the target system.
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