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HI4P5051-5

HI4P5051-5

Manufacturer No:

HI4P5051-5

Manufacturer:

Harris Corporation

Description:

IC SWITCH SPDT X 2 45OHM 20PLCC

Datasheet:

Datasheet

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HI4P5051-5 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-PLCC (9x9)
  • Package / Case
    20-LCC (J-Lead)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 75°C
  • Crosstalk
    -88dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    2nA
  • Channel Capacitance (CS(off), CD(off))
    11pF, 11pF
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Switch Time (Ton, Toff) (Max)
    500ns, 500ns
  • Voltage - Supply, Dual (V±)
    ±15V
  • Voltage - Supply, Single (V+)
    15V
  • Channel-to-Channel Matching (ΔRon)
    1Ohm
  • On-State Resistance (Max)
    45Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPDT
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The M2S090-FCS325I integrated circuit chip is a low-power, high-performance FPGA (Field-Programmable Gate Array) chip manufactured by Microsemi. It offers several advantages and can be applied in various scenarios, including:1. Low power consumption: The M2S090-FCS325I chip is designed to operate with minimal power consumption, making it suitable for power-constrained devices or applications. This feature enables battery-powered devices to extend their operational life.2. High-performance capabilities: The chip provides excellent computational power with its FPGA architecture, allowing for the implementation of complex algorithms and processing tasks. It can handle high-speed data processing and perform advanced functions efficiently.3. FPGA flexibility: Being a programmable chip, the M2S090-FCS325I offers extensive flexibility to various applications. It allows users to reconfigure the hardware functionalities after manufacturing, providing adaptability and customization options. This makes it suitable for prototyping, product development, and applications requiring frequent updates or modifications.4. Application-specific integration: The M2S090-FCS325I chip features numerous I/O interfaces and peripherals, enabling seamless integration with specific application requirements. It can be utilized in networking, telecom, automotive, industrial, and other fields that demand a combination of hardware and software processing.5. Rapid development and time-to-market: With its versatile programming capabilities, the M2S090-FCS325I chip accelerates the development cycle of various applications. It allows developers to quickly iterate on designs, test functionality, and reduce time-to-market for their products.6. Enhanced security features: The chip offers robust security mechanisms, including authentication and encryption capabilities. This makes it suitable for applications that require secure data processing, transfer, and storage, such as in IoT devices, industrial control systems, and financial transactions.Overall, the M2S090-FCS325I integrated circuit chip's advantages and versatile capabilities make it well-suited for a broad range of applications requiring low power consumption, high performance, flexibility, integration, and security.
HI4P5051-5 Relevant information