DG1412EEQ-T1-GE4

DG1412EEQ-T1-GE4

Manufacturer No:

DG1412EEQ-T1-GE4

Manufacturer:

Vishay Siliconix

Description:

IC SW SPST-NOX4 1.5OHM 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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DG1412EEQ-T1-GE4 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C (TA)
  • Crosstalk
    -104dB @ 1MHz
  • Current - Leakage (IS(off)) (Max)
    500pA
  • Channel Capacitance (CS(off), CD(off))
    24pF, 23pF
  • Charge Injection
    -41pC
  • -3db Bandwidth
    150MHz
  • Switch Time (Ton, Toff) (Max)
    140ns, 110ns
  • Voltage - Supply, Dual (V±)
    ±4.5V ~ 15V
  • Voltage - Supply, Single (V+)
    4.5V ~ 24V
  • Channel-to-Channel Matching (ΔRon)
    40mOhm
  • On-State Resistance (Max)
    1.5Ohm
  • Number of Circuits
    4
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The M2S010-FGG484 integrated circuit chip is a specific model of the Microsemi SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S010-FGG484 chip combines an FPGA fabric with a hard ARM Cortex-M3 processor core, providing the flexibility of programmable logic and the processing power of a microcontroller in a single chip. 2. Integration: The chip integrates various peripherals, including UART, SPI, I2C, GPIO, timers, and memory controllers, reducing the need for external components and simplifying system design. 3. Security: SmartFusion2 devices offer advanced security features, such as secure boot, tamper detection, and secure key storage, making them suitable for applications that require robust security measures. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High reliability: SmartFusion2 devices are built with reliability features like error correction codes (ECC) and single-event upset (SEU) mitigation, ensuring reliable operation in harsh environments.Application scenarios: 1. Industrial automation: The M2S010-FGG484 chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols implementation. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller capabilities, the chip is suitable for IoT applications that require both programmable logic and processing power, such as edge computing, sensor fusion, and gateway devices. 3. Aerospace and defense: The security features and reliability of SmartFusion2 devices make them suitable for aerospace and defense applications, including avionics, secure communication systems, and military-grade equipment. 4. Medical devices: The chip's low power consumption, integration of peripherals, and security features make it suitable for medical devices like patient monitoring systems, portable diagnostic equipment, and implantable devices. 5. Automotive: The M2S010-FGG484 chip can be used in automotive applications, such as advanced driver-assistance systems (ADAS), infotainment systems, and vehicle-to-vehicle communication.These are just a few examples, and the versatility of the M2S010-FGG484 chip allows it to be applied in various other domains where a combination of programmable logic and microcontroller capabilities is required.