In Stock : 3767
Please send RFQ , we will respond immediately.
ISL8394IB Specifications
-
TypeParameter
-
Supplier Device Package20-SOIC
-
Package / Case20-SOIC (0.295", 7.50mm Width)
-
Mounting TypeSurface Mount
-
Operating Temperature-40°C ~ 85°C (TA)
-
Crosstalk-92dB @ 1MHz
-
Current - Leakage (IS(off)) (Max)200pA
-
Channel Capacitance (CS(off), CD(off))12pF, 12pF
-
Charge Injection5pC
-
-3db Bandwidth-
-
Switch Time (Ton, Toff) (Max)130ns, 75ns
-
Voltage - Supply, Dual (V±)±2V ~ 6V
-
Voltage - Supply, Single (V+)2V ~ 12V
-
Channel-to-Channel Matching (ΔRon)500mOhm
-
On-State Resistance (Max)35Ohm
-
Number of Circuits4
-
Multiplexer/Demultiplexer Circuit2:1
-
Switch CircuitSPDT
-
PackagingTube
-
Product StatusObsolete
-
Series-
The M2S090TS-1FGG484I is a specific model of integrated circuit (IC) chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this IC chip:Advantages: 1. Versatility: The M2S090TS-1FGG484I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 processor core. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, processor, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S090TS-1FGG484I, offers advanced security features such as secure boot, tamper detection, and secure key storage. This makes it suitable for applications that require robust security measures. 4. Low power consumption: The M2S090TS-1FGG484I chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications. 5. High performance: With a combination of FPGA fabric and a Cortex-M3 processor, the chip offers high-performance computing capabilities, enabling complex algorithms and real-time processing.Application Scenarios: 1. Industrial Automation: The M2S090TS-1FGG484I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and real-time data processing. Its FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its low power consumption and integrated ARM Cortex-M3 processor, the chip can be used in IoT devices for edge computing, data aggregation, and secure communication. 3. Aerospace and Defense: The M2S090TS-1FGG484I chip's security features, high performance, and integration make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication devices, and military-grade embedded systems. 4. Medical Devices: The chip's versatility and security features make it suitable for medical devices such as patient monitoring systems, medical imaging equipment, and portable diagnostic devices. 5. Communications: The M2S090TS-1FGG484I chip can be used in communication systems, including network routers, switches, and base stations, where its FPGA fabric can be utilized for protocol customization and performance optimization.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design considerations of each project.
ISL8394IB Relevant information
-
DG509AAZ/883B
Analog Devices Inc./Maxim Integrated -
TS12A4514PE4
Analog Devices Inc. -
TS3A24159DGSR
Analog Devices Inc. -
TS12A4515DBVR
Analog Devices Inc. -
SW202NBC
NXP Semiconductors -
MAX464CNI
NXP Semiconductors -
MC74HC4051ADWR2G
NXP Semiconductors -
74LVC1G3157GWXL
Nexperia USA Inc. -
SW202NBC
NXP Semiconductors -
TDA3683J/N2S,112
Analog Devices Inc.