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ISL8499IRZ-T Specifications
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TypeParameter
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Supplier Device Package16-QFN (3x3)
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Package / Case16-VFQFN Exposed Pad
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Crosstalk-98dB @ 100kHz
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Current - Leakage (IS(off)) (Max)50nA
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Channel Capacitance (CS(off), CD(off))106pF
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Charge Injection-120pC
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-3db Bandwidth-
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Switch Time (Ton, Toff) (Max)25ns, 23ns
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Voltage - Supply, Dual (V±)-
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Voltage - Supply, Single (V+)1.65V ~ 4.5V
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Channel-to-Channel Matching (ΔRon)40mOhm
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On-State Resistance (Max)250mOhm
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Number of Circuits4
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Multiplexer/Demultiplexer Circuit2:1
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Switch CircuitSPDT
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PackagingBulk
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Product StatusObsolete
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Series-
The M2S090T-1FCSG325I is an integrated circuit chip manufactured by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S090T-1FCSG325I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family of chips, including the M2S090T-1FCSG325I, offers advanced security features like secure boot, tamper detection, and secure key storage. These features make it suitable for applications that require high levels of security, such as industrial control systems, defense, and aerospace. 4. Low power consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications.Application scenarios: 1. Industrial automation: The M2S090T-1FCSG325I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. Its FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its combination of FPGA and microcontroller subsystem, the chip can be used in IoT devices for edge computing, data processing, and connectivity. Its security features also make it suitable for secure IoT applications. 3. Medical devices: The chip's low power consumption, integration, and security features make it suitable for medical devices like patient monitoring systems, portable diagnostic devices, and medical imaging equipment. 4. Aerospace and defense: The chip's security features, along with its ability to withstand harsh environments, make it suitable for aerospace and defense applications. It can be used in avionics systems, secure communication systems, and military-grade equipment.These are just a few examples of the advantages and application scenarios of the M2S090T-1FCSG325I chip. Its versatility, integration, security features, and low power consumption make it a suitable choice for a wide range of applications in various industries.
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