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HI9P0200-9

HI9P0200-9

Manufacturer No:

HI9P0200-9

Manufacturer:

Harris Corporation

Description:

IC SWITCH SPST-NOX2 80OHM 14SOIC

Datasheet:

Datasheet

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Payment:

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HI9P0200-9 Specifications

  • Type
    Parameter
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Voltage - Supply, Dual (V±)
    ±15V
  • Supplier Device Package
    14-SOIC
  • Package / Case
    14-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Crosstalk
    -
  • Current - Leakage (IS(off)) (Max)
    50nA
  • Channel Capacitance (CS(off), CD(off))
    5.5pF, 5.5pF
  • Switch Time (Ton, Toff) (Max)
    500ns, 500ns
  • Voltage - Supply, Single (V+)
    15V
  • Channel-to-Channel Matching (ΔRon)
    -
  • On-State Resistance (Max)
    80Ohm
  • Number of Circuits
    2
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    SPST - NO
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The M2S050TS-FGG484I is an integrated circuit chip from Microsemi, which belongs to their SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S050TS-FGG484I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 processor core. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, processor, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: SmartFusion2 devices incorporate security features like secure boot, tamper detection, and bitstream encryption. These features help protect the system against unauthorized access, tampering, and IP theft. 4. Low power consumption: The M2S050TS-FGG484I chip is designed to be power-efficient, making it suitable for battery-powered or energy-conscious applications. 5. High reliability: Microsemi's SmartFusion2 devices are known for their reliability and robustness, making them suitable for applications that require high levels of reliability and fault tolerance.Application scenarios: 1. Industrial automation: The M2S050TS-FGG484I chip can be used in industrial automation systems for tasks like motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization and adaptation to specific industrial requirements. 2. Internet of Things (IoT): With its low power consumption and integration of FPGA and processor, the chip can be used in IoT devices for edge computing, data processing, and connectivity. 3. Aerospace and defense: The security features of the SmartFusion2 devices make them suitable for aerospace and defense applications, where data integrity, secure communication, and protection against tampering are critical. 4. Medical devices: The chip's reliability, low power consumption, and integration make it suitable for medical devices like patient monitoring systems, portable diagnostic devices, and medical imaging equipment. 5. Communications: The M2S050TS-FGG484I chip can be used in communication systems for tasks like protocol conversion, signal processing, and encryption/decryption.These are just a few examples, and the versatility of the chip allows it to be used in various other applications where a combination of FPGA and processor capabilities is required.
HI9P0200-9 Relevant information