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HI3-5047-5

HI3-5047-5

Manufacturer No:

HI3-5047-5

Manufacturer:

Harris Corporation

Description:

IC SWITCH 4PST X 1 75OHM 16DIP

Datasheet:

Datasheet

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HI3-5047-5 Specifications

  • Type
    Parameter
  • Charge Injection
    -
  • -3db Bandwidth
    -
  • Voltage - Supply, Dual (V±)
    ±15V
  • Supplier Device Package
    16-PDIP
  • Package / Case
    16-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    0°C ~ 75°C
  • Crosstalk
    -88dB @ 100kHz
  • Current - Leakage (IS(off)) (Max)
    2nA
  • Channel Capacitance (CS(off), CD(off))
    11pF, 11pF
  • Switch Time (Ton, Toff) (Max)
    500ns, 500ns
  • Voltage - Supply, Single (V+)
    15V
  • Channel-to-Channel Matching (ΔRon)
    2Ohm
  • On-State Resistance (Max)
    75Ohm
  • Number of Circuits
    1
  • Multiplexer/Demultiplexer Circuit
    1:1
  • Switch Circuit
    4PST
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The XC7Z020-3CLG400E is a specific model of the Xilinx Zynq-7000 family of integrated circuit chips. Here are some advantages and application scenarios of this chip:Advantages: 1. Programmable System-on-Chip (SoC): The XC7Z020-3CLG400E combines a dual-core ARM Cortex-A9 processor with programmable logic, allowing for both software and hardware development on a single chip. 2. High Performance: The chip offers high processing power with up to 866 MHz clock frequency and a large number of programmable logic cells, enabling complex applications. 3. Low Power Consumption: The XC7Z020-3CLG400E is designed to be power-efficient, making it suitable for battery-powered or energy-conscious devices. 4. Flexible Connectivity: The chip provides various interfaces such as USB, Ethernet, SPI, I2C, UART, and more, allowing for easy integration with other devices and systems. 5. Rich Development Ecosystem: Xilinx provides a comprehensive development ecosystem, including software tools, libraries, and IP cores, making it easier to develop applications on this chip.Application Scenarios: 1. Embedded Systems: The XC7Z020-3CLG400E is commonly used in embedded systems where both software and hardware acceleration are required. It can be used in applications like industrial automation, robotics, automotive, and aerospace. 2. High-Performance Computing: The chip's processing power and programmable logic make it suitable for high-performance computing applications, such as signal processing, image and video processing, and data analytics. 3. Internet of Things (IoT): With its low power consumption and connectivity options, the XC7Z020-3CLG400E can be used in IoT devices, enabling edge computing, sensor integration, and data processing at the device level. 4. Communication Systems: The chip's programmable logic can be utilized to implement various communication protocols, making it suitable for applications like software-defined radios, wireless base stations, and network switches. 5. Prototyping and Development: The XC7Z020-3CLG400E is often used in prototyping and development boards, allowing engineers and researchers to quickly develop and test their ideas before moving to production.It's important to note that the specific application scenarios may vary depending on the requirements and customization of the chip in a particular project.
HI3-5047-5 Relevant information