MAX4754AEBE+
Manufacturer No:
MAX4754AEBE+
Manufacturer:
Description:
IC SWITCH SPDTX2 850MOHM 16UCSP
Datasheet:
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In Stock : 1323
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MAX4754AEBE+ Specifications
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TypeParameter
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Charge Injection300pC
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-3db Bandwidth10MHz
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Voltage - Supply, Dual (V±)-
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Supplier Device Package16-UCSP (2.02x2.02)
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Package / Case16-WFBGA, CSPBGA
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Crosstalk-90dB @ 100kHz
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Current - Leakage (IS(off)) (Max)4nA
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Channel Capacitance (CS(off), CD(off))180pF, 300pF
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Switch Time (Ton, Toff) (Max)140ns, 50ns
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Voltage - Supply, Single (V+)1.8V ~ 5.5V
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Channel-to-Channel Matching (ΔRon)100mOhm
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On-State Resistance (Max)850mOhm
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Number of Circuits2
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Multiplexer/Demultiplexer Circuit2:1
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Switch CircuitSPDT - Open/Closed
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PackagingBulk
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Product StatusActive
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Series-
The M2S025-FCSG325I is an integrated circuit chip developed by Microsemi Corporation. It belongs to the SmartFusion2 family of system-on-chip (SoC) devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Versatility: The M2S025-FCSG325I chip combines an FPGA (Field-Programmable Gate Array) fabric with a hard ARM Cortex-M3 microcontroller subsystem. This combination allows for flexible hardware customization and software programmability, making it suitable for a wide range of applications. 2. Integration: The chip integrates various components, including FPGA fabric, microcontroller subsystem, memory, and peripherals, onto a single chip. This integration reduces the need for external components, simplifies the design, and saves board space. 3. Security: The SmartFusion2 family incorporates security features such as secure boot, tamper detection, and secure key storage. These features enhance the security of the system and protect against unauthorized access or tampering. 4. Low power consumption: The M2S025-FCSG325I chip is designed to operate with low power consumption, making it suitable for battery-powered or energy-efficient applications. 5. High performance: The FPGA fabric and ARM Cortex-M3 microcontroller subsystem provide high-performance processing capabilities, enabling complex algorithms and real-time processing.Application scenarios: 1. Industrial automation: The M2S025-FCSG325I chip can be used in industrial automation systems for tasks such as motor control, sensor interfacing, and communication protocols. The FPGA fabric allows for customization of interfaces and protocols, while the microcontroller subsystem handles control and communication tasks. 2. Internet of Things (IoT): With its low power consumption and security features, the chip is suitable for IoT applications. It can be used in smart home devices, environmental monitoring systems, or wearable devices, where both hardware customization and software programmability are required. 3. Aerospace and defense: The M2S025-FCSG325I chip's high-performance processing capabilities and security features make it suitable for aerospace and defense applications. It can be used in avionics systems, communication systems, or secure data processing applications. 4. Medical devices: The chip's integration, low power consumption, and security features make it suitable for medical devices. It can be used in patient monitoring systems, medical imaging devices, or portable medical equipment. 5. Automotive: The M2S025-FCSG325I chip can be used in automotive applications such as advanced driver-assistance systems (ADAS), infotainment systems, or engine control units. The FPGA fabric allows for customization of interfaces and protocols, while the microcontroller subsystem handles control and processing tasks.These are just a few examples of the advantages and application scenarios of the M2S025-FCSG325I chip. The versatility and integration of this chip make it suitable for a wide range of applications where both hardware customization and software programmability are required.
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